日本半固化片浸渍加工技术的新进展（1）——对近两年日本专利中半固化片浸渍加工技术创新例的综述
일본반고화편침지가공기술적신진전（1）——대근량년일본전리중반고화편침지가공기술창신례적종술
Recent development of technology about dipping and process of prepreg in Japan（1）——Review of innovation example about dipping of prepreg in Japanese patent recent two years
  • 万方数据
    印制电路信息 인제전로신식
    PRINTED CIRCUIT INFORMATION
    2011年 11期 12-17 ,共6页

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    印制电路板%覆铜板%浸渍加工%半固化片 印製電路闆%覆銅闆%浸漬加工%半固化片
    인제전로판%복동판%침지가공%반고화편
    Printed Circuit board（PCB）%Copper Clad Laminate（CCL）%impregnation processability%prepreg
    以2009年~2010年发表的半固化片浸渍加工技术与设备的日本专利为研究对象,对此创新内容及思路作以综述。
    이2009년~2010년발표적반고화편침지가공기술여설비적일본전리위연구대상,대차창신내용급사로작이종술。
    In the paper,the technology and equipment about impregnation processability of prepreg according to Japanese patent from 2009 to 2010 were researched.At the same,content and method of innovation were reviewed.
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