CAJ | 학술논문

采用反应直流磁控溅射镀膜法,在氮气分压为0.9Pa、不同基底温度下、玻璃基底上制备了纳米多晶Cu_3N薄膜,并研究了基底温度对薄膜结构和性能的影响.结果表明,当基底温度为100℃及以下时,薄膜以[111]方向择优生长为主;在150℃及200℃时,薄膜以[100]方向择优生长为主;250℃时开始出现Cu的[111]方向生长,300℃时已完全不能形成Cu_3N晶体,只有明显的Cu晶体.随基底温度的升高,薄膜的沉积速率在13～28nm/min呈U型变化,低温和高温时较高,150℃时最低;薄膜的电阻率显著降低;薄膜的显微硬度先升后降,100℃时显微硬度最大.
채용반응직류자공천사도막법,재담기분압위0.9Pa、불동기저온도하、파리기저상제비료납미다정Cu_3N박막,병연구료기저온도대박막결구화성능적영향.결과표명,당기저온도위100℃급이하시,박막이[111]방향택우생장위주;재150℃급200℃시,박막이[100]방향택우생장위주;250℃시개시출현Cu적[111]방향생장,300℃시이완전불능형성Cu_3N정체,지유명현적Cu정체.수기저온도적승고,박막적침적속솔재13～28nm/min정U형변화,저온화고온시교고,150℃시최저;박막적전조솔현저강저;박막적현미경도선승후강,100℃시현미경도최대.
Copper nitride thin films are deposited on glass substrates by reactive DC magnetron sputtering at 0.9Pa N_2-gas partial pressure and different substrate temperatures.The different substrate temperatures on the structures and properties of copper nitride thin films have been investigated.The preferred crystalline orientation of the films changes with the substrate temperature as[111]-oriented at 50℃,100℃ and [100]-oriented at 150℃,200℃,250℃,and reach 300℃ the all XRD peaks of Cu_3N can not be observed,but the peaks of Cu can be noticed clearly,these results indicate that 300℃ substrate temperature is too high for the nitrification of Cu.The substrate temperature not only affects the crystal structure of the Cu_3N films but also affects its deposition rate,resistivity and microhardness.In experimental condition,the deposition rate of Cu_3 N films is 13～28nm/min and changes with the increasing substrate temperature like U,there is high deposition rate with the low and high substrate temperature but there is a minimum deposition rate with 150℃ substrate temperature.The resistivity of Cu_3N films decreases monotonously with the increasing substrate temperature.The microhardness of films changes with the increasing substrate temperature,there is a maximum microhardness 100℃ substrate temperature.