半导体技术
半導體技術
반도체기술
SEMICONDUCTOR TECHNOLOGY
2009年
12期
1173-1176
,共4页
微机电系统%气密封装%玻璃浆料键合%低温%圆片级封装
微機電繫統%氣密封裝%玻璃漿料鍵閤%低溫%圓片級封裝
미궤전계통%기밀봉장%파리장료건합%저온%원편급봉장
MEMS device%hermetic package%glass frit bonding%low temperature package%waferlevel package
玻璃浆料是一种常用于MEMS器件封装的密封材料.系统研究了MEMS器件在低温下使用玻璃浆料键合硅和玻璃的过程.与大多数MEMS器件采用的玻璃浆料相比(烧结温度400℃以上),此工艺(烧结温度350℃)在键合完成后所形成的封装结构同样具有较高的剪切强度(封装器件剪切强度大于360 kPa),同时具有较好的气密性(合格率达到93.3%),漏率测试结果符合相关标准.结果表明,在保证MEMS器件封装剪切强度和气密性的同时,降低键合温度条件是可以实现的.
玻璃漿料是一種常用于MEMS器件封裝的密封材料.繫統研究瞭MEMS器件在低溫下使用玻璃漿料鍵閤硅和玻璃的過程.與大多數MEMS器件採用的玻璃漿料相比(燒結溫度400℃以上),此工藝(燒結溫度350℃)在鍵閤完成後所形成的封裝結構同樣具有較高的剪切彊度(封裝器件剪切彊度大于360 kPa),同時具有較好的氣密性(閤格率達到93.3%),漏率測試結果符閤相關標準.結果錶明,在保證MEMS器件封裝剪切彊度和氣密性的同時,降低鍵閤溫度條件是可以實現的.
파리장료시일충상용우MEMS기건봉장적밀봉재료.계통연구료MEMS기건재저온하사용파리장료건합규화파리적과정.여대다수MEMS기건채용적파리장료상비(소결온도400℃이상),차공예(소결온도350℃)재건합완성후소형성적봉장결구동양구유교고적전절강도(봉장기건전절강도대우360 kPa),동시구유교호적기밀성(합격솔체도93.3%),루솔측시결과부합상관표준.결과표명,재보증MEMS기건봉장전절강도화기밀성적동시,강저건합온도조건시가이실현적.
Glass frit is a kind of sealing material for MEMS device. The bonding process of Si and glass for MEMS device at low-temperature with glass frit were studied. Compared to the glass frit for most MEMS devices (sintering temperature is above 400℃), the package structure formed after bonding (sintering temperature is 350℃) by the new process has higher shear strength (> 360 kPa), and better sealing (yield is up to 93.3%). The leak rate fits the relative standard. The results show that both shear strength and leak rate are encouraging. It is proved that the MEMS package can be hermetically sealed at the low temperature of 350℃.
