稀有金属
稀有金屬
희유금속
CHINESE JOURNAL OF RARE METALS
2010年
2期
221-226
,共6页
张习敏%郭宏%尹法章%张永忠%范叶明
張習敏%郭宏%尹法章%張永忠%範葉明
장습민%곽굉%윤법장%장영충%범협명
Diamond/Cu复合材料%界面%热导率%Cr%压力浸渗
Diamond/Cu複閤材料%界麵%熱導率%Cr%壓力浸滲
Diamond/Cu복합재료%계면%열도솔%Cr%압력침삼
Diamond/Cu composites%interface%thermal conductivity%Cr%pressure infiltration process
采用预制件制备,压力浸渗金属工艺制备Diamond/Cu复合材料,分析了cu基体合金化及金刚石颗粒表面金属化情况下,Cr元素对复合材料界面结构和热性能的影响.结果表明,Diamond/Cu-Cr复合材料中金刚石与Cu-Cr合金界面结合良好,Cr元素在界面处发生富集并与金刚石反应生成Cr_3C_2,其界面结构为金刚石-Cr_3C_2-富Cr的Cu-Cr合金层-Cu-Cr基体,复合材料的热导率达到520W·m~(-1)·K~(-1);Diamond-Cr/Cu复合材料中金刚石表面金属化Cr层在熔渗过程中与Cu互扩散,促进界面结合,形成金刚石-Cr_3C_2层-纯Cr层-Cu-Cr互扩散层-Cu的界面结构.与Diamond/Cu-Cr复合材料相比界面处增加了Cr层,材料的热导率仅为279W·m~(-1)·K~(-1),但均高于Diamond/Cu复合材料的热导率.
採用預製件製備,壓力浸滲金屬工藝製備Diamond/Cu複閤材料,分析瞭cu基體閤金化及金剛石顆粒錶麵金屬化情況下,Cr元素對複閤材料界麵結構和熱性能的影響.結果錶明,Diamond/Cu-Cr複閤材料中金剛石與Cu-Cr閤金界麵結閤良好,Cr元素在界麵處髮生富集併與金剛石反應生成Cr_3C_2,其界麵結構為金剛石-Cr_3C_2-富Cr的Cu-Cr閤金層-Cu-Cr基體,複閤材料的熱導率達到520W·m~(-1)·K~(-1);Diamond-Cr/Cu複閤材料中金剛石錶麵金屬化Cr層在鎔滲過程中與Cu互擴散,促進界麵結閤,形成金剛石-Cr_3C_2層-純Cr層-Cu-Cr互擴散層-Cu的界麵結構.與Diamond/Cu-Cr複閤材料相比界麵處增加瞭Cr層,材料的熱導率僅為279W·m~(-1)·K~(-1),但均高于Diamond/Cu複閤材料的熱導率.
채용예제건제비,압력침삼금속공예제비Diamond/Cu복합재료,분석료cu기체합금화급금강석과립표면금속화정황하,Cr원소대복합재료계면결구화열성능적영향.결과표명,Diamond/Cu-Cr복합재료중금강석여Cu-Cr합금계면결합량호,Cr원소재계면처발생부집병여금강석반응생성Cr_3C_2,기계면결구위금강석-Cr_3C_2-부Cr적Cu-Cr합금층-Cu-Cr기체,복합재료적열도솔체도520W·m~(-1)·K~(-1);Diamond-Cr/Cu복합재료중금강석표면금속화Cr층재용삼과정중여Cu호확산,촉진계면결합,형성금강석-Cr_3C_2층-순Cr층-Cu-Cr호확산층-Cu적계면결구.여Diamond/Cu-Cr복합재료상비계면처증가료Cr층,재료적열도솔부위279W·m~(-1)·K~(-1),단균고우Diamond/Cu복합재료적열도솔.
Diamond/Cu composites were fabricated by pressure infiltration process. Influences of Cr element on interface structures and thermal properties of the Diamond Cu composites were analyzed. It was found that in Diamond/Cu-Cr composites, Cr accumulated on the interface and reacted with Diamond to form Cr_3 C_2, which promoted the interfacial bonding. The interface structure formed between Diamond and Cu-Cr alloy was Diamond-Cr_3 C_2 with rich Cr Cu-Cr alloy with Cu-Cr alloy sequentially. And the thermal conductivity is 520 W·m~(-1)·K~(-1). In Diamond-Cr/Cu composites, Cr coating on Diamond inter-diffused with Cu during the infiltration process, which accelerated the interfacial bonding. The interface structure, Diamond-chromium carbide-Cr-inter-diffusion layer between Cu and Cr-Cu, was formed. Compared with Diamond/Cu-Cr composites, Cr layer existed in the interface of Diamond-Cr/Cu composites. The thermal conductivity of Diamond-Cr/Cu composites was 279 W·m~(-1)·K~(-1) , higher than that of Diamond/Cu composites.