CAJ | 학술논문

预成型焊片的润湿性直接关系到光电子封装的可靠性。常用的焊料润湿性评价方法对于评价预成型焊片润湿性具有很大局限性。提出了一种动态测试焊料润湿性的方法,并设计了一套测试系统。通过铺展面积与时间的关系曲线得出最大铺展面积、润湿时间、平均润湿速度和瞬时润湿速度等特征参数,对预成型焊片的润湿性进行评价。实验表明,该润湿性动态测试系统能够方便地获得铺展面积与时间的关系曲线,从中可得出不同预成型焊片在特定环境下润湿性的变化规律,也说明了该动态测试方法的可行性。
예성형한편적윤습성직접관계도광전자봉장적가고성。상용적한료윤습성평개방법대우평개예성형한편윤습성구유흔대국한성。제출료일충동태측시한료윤습성적방법,병설계료일투측시계통。통과포전면적여시간적관계곡선득출최대포전면적、윤습시간、평균윤습속도화순시윤습속도등특정삼수,대예성형한편적윤습성진행평개。실험표명,해윤습성동태측시계통능구방편지획득포전면적여시간적관계곡선,종중가득출불동예성형한편재특정배경하윤습성적변화규률,야설명료해동태측시방법적가행성。
The wettability of solder preforms will have a direct relationship with the reliability of optoelectronic packages.The current evaluation of the solder wettability has significant limitation to apply in the solder performs.Put forward an innovative dynamic wetting test method,and design a testing system.The spreading area-time curve can be obtained by the method.Some characteristic parameters such as maximum spreading area,wetting time,average spreading speed and instantaneous spreading speed can be reached to evaluate the wettability of solder preforms through the curve.Experiments show that the dynamic wetting testing system can easily get the spreading area with the time curve and the variation of wettability of different solder preforms in a particular environment can be known,and the feasibility of the dynamic test method has also been proved.