材料保护
材料保護
재료보호
MATERIALS PROTECTION
2000年
8期
18-19
,共2页
沈峥%吴俊%黄清安%喻敬贤
瀋崢%吳俊%黃清安%喻敬賢
침쟁%오준%황청안%유경현
电沉积%稀土%镍基合金
電沉積%稀土%鎳基閤金
전침적%희토%얼기합금
用动电位扫描法研究 Ni-Ce-P合金电沉积行为，结果表明：配体和 H3PO3 可使金属离子的析出电位正移，加上Ni2+的诱导共沉积，使得 Ni-Ce-P合金从水溶液中电沉积出来，XPS谱图和能量弥散仪测试结果表明，镀层成分分别为：81．9(wt)％ Ni，9．77(wt)％Ce，6．32(wt)％P。
用動電位掃描法研究 Ni-Ce-P閤金電沉積行為，結果錶明：配體和 H3PO3 可使金屬離子的析齣電位正移，加上Ni2+的誘導共沉積，使得 Ni-Ce-P閤金從水溶液中電沉積齣來，XPS譜圖和能量瀰散儀測試結果錶明，鍍層成分分彆為：81．9(wt)％ Ni，9．77(wt)％Ce，6．32(wt)％P。
용동전위소묘법연구 Ni-Ce-P합금전침적행위，결과표명：배체화 H3PO3 가사금속리자적석출전위정이，가상Ni2+적유도공침적，사득 Ni-Ce-P합금종수용액중전침적출래，XPS보도화능량미산의측시결과표명，도층성분분별위：81．9(wt)％ Ni，9．77(wt)％Ce，6．32(wt)％P。
The mechanism of Ni-Ce-P alloy electrodeposition in aqueous solutions was studied with linear sweep voltammetry (LSV). It showed that the electrodeposition potentials of metallic ions shifted toward positive drection because of the effects of complexing agents and H3PO3 as well as the induction effect of Ni2 +. The components of the deposit were 81.9% Ni, 9. 77% Ce and 6. 32% P.
