印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2011年
10期
27-29,60
,共4页
厚铜板%除钻污%品质
厚銅闆%除鑽汙%品質
후동판%제찬오%품질
thick copper boards%desmearing%quality
在厚铜板件的生产制作过程中,除钻污是极为重要的工序,对厚铜板的品质性能有巨大的影响作用。为了保证生产品质,优化工艺流程,通过对除钻污后板的孔壁粗糙度及灯芯效应的分析、热应力测试,探讨了除钻污对厚铜板品质的影响,找出厚铜板除钻污的最佳生产方式。
在厚銅闆件的生產製作過程中,除鑽汙是極為重要的工序,對厚銅闆的品質性能有巨大的影響作用。為瞭保證生產品質,優化工藝流程,通過對除鑽汙後闆的孔壁粗糙度及燈芯效應的分析、熱應力測試,探討瞭除鑽汙對厚銅闆品質的影響,找齣厚銅闆除鑽汙的最佳生產方式。
재후동판건적생산제작과정중,제찬오시겁위중요적공서,대후동판적품질성능유거대적영향작용。위료보증생산품질,우화공예류정,통과대제찬오후판적공벽조조도급등심효응적분석、열응력측시,탐토료제찬오대후동판품질적영향,조출후동판제찬오적최가생산방식。
Desmearing is a very important process in the production of thick copper boards, and has an important effect on the quality of these boards. In order to insure the ,quality of the thick copper boards and optimizes the process flow, the paper hereby analyses the wick effect and the hole wall roughness, thermal test of the desmeared boards, discusses the influence of the desmearing on the quality of the thick copper boards. And finally, the best way of desmearing of the thick copper boards is found out.