CAJ | 학술논문

自热效应对集成电路的性能和功耗有很大的影响。该文以HSPICE电路模拟程序为电路模拟的基础，以改进的热点温度估算方法为热学模拟的基础，采用解耦法实现了集成电路的电热耦合时序模拟软件。给定芯片的版图信息和输入信号模式，该软件能够计算芯片的工作温度分布，并得到该温度分布下的电路性能，与传统的数值方法比较，速度快一个数量级以上。采用红外热成像方法测量THF9305传真机热印头驱动专用集成电路芯片的工作温度分布，实验结果与模拟结果吻合较好。
자열효응대집성전로적성능화공모유흔대적영향。해문이HSPICE전로모의정서위전로모의적기출，이개진적열점온도고산방법위열학모의적기출，채용해우법실현료집성전로적전열우합시서모의연건。급정심편적판도신식화수입신호모식，해연건능구계산심편적공작온도분포，병득도해온도분포하적전로성능，여전통적수치방법비교，속도쾌일개수량급이상。채용홍외열성상방법측량THF9305전진궤열인두구동전용집성전로심편적공작온도분포，실험결과여모의결과문합교호。
The self-heating effects in integrated circuits greatly impactcircuit performance and power consumption. The HSPICE circuit simulator and an improved hot spot thermal analysis method were used in a new fast electro-thermal relaxation method to study the self-heating effects. Given the layout information and the input signal pattern, the method can calculate the temperature distribution on a chip and the chip performance. The simulation result agrees well with the temperature distribution of the facsimile thermal printing head ASIC ship measured with an infrared thermal imaging system.