CAJ | 학술논문

通过功率LED器件封装工艺技术的改进来降低芯片结温,从而减缓器件光衰速率,延长其预期的工作寿命时间.对用于封装的关键原材料的选取进行了对比实验,指出了采用纳米级材料改进导热可降低热阻,论述了正确选用混胶材料和工艺.可以减缓器件光衰速率,达到在较高的环境温度条件下,器件使用寿命大于50 000 h.论述了器件芯片的结温对光、电、色性能的影响和不同结温其预期工作寿命时间也不同的关联性.
통과공솔LED기건봉장공예기술적개진래강저심편결온,종이감완기건광쇠속솔,연장기예기적공작수명시간.대용우봉장적관건원재료적선취진행료대비실험,지출료채용납미급재료개진도열가강저열조,논술료정학선용혼효재료화공예.가이감완기건광쇠속솔,체도재교고적배경온도조건하,기건사용수명대우50 000 h.논술료기건심편적결온대광、전、색성능적영향화불동결온기예기공작수명시간야불동적관련성.
The power LED device packaging process technology was improved to reduce the chip junction temperature, so the LED devices brightness decay rate was slowed down to extend the expected life time. The key raw materials used for packaging were compared by tests. It is pointed out that nano-scale materials can be use to reduced the thermal resistance. Correct selection of mixed plastic materials and processes can slow down the brightness decay rate of device, device lifetime greater than 50 000 h was achieved at a higher ambient temperature conditions. The effects of chip on light, electricity, and the color properties were discussed, and the different junction temperature resulting in different working life time were also mentioned.