CAJ | 학술논문

随着电子元器件向微型、高灵敏、集成等方向发展,薄膜材料及器件在微机电(MEMS)系统中得到广泛应用,而测量压电薄膜特性参数的方法与体材料相比有很大的不同.介绍了当前测量压电薄膜特性参数的两大类方法:直接测量法(包括气腔压力法、悬臂梁法、激光干涉法和激光多普勒振动法)和间接测量法(传统阻抗分析法),详细分析了这些方法的基本原理、测试表征、应用状况及存在的问题,比较了这些方法的优缺点,并对未来压电薄膜特性参数的测试表征作了展望.
수착전자원기건향미형、고령민、집성등방향발전,박막재료급기건재미궤전(MEMS)계통중득도엄범응용,이측량압전박막특성삼수적방법여체재료상비유흔대적불동.개소료당전측량압전박막특성삼수적량대류방법:직접측량법(포괄기강압역법、현비량법、격광간섭법화격광다보륵진동법)화간접측량법(전통조항분석법),상세분석료저사방법적기본원리、측시표정、응용상황급존재적문제,비교료저사방법적우결점,병대미래압전박막특성삼수적측시표정작료전망.
Film materials and devices have been widely used in micro-electromechanical system (MEMS) system with the development of micromation, high sensitivity and integration of electronic devices. But the measurement methods for piezoelectric properties of piezoelectric thin films are very different from those of bulk materials. Two categories of measuring piezoelectric properties of piezoelectric thin films were introduced in this paper: direct measurement(including pneumatic pressure rig, cantilever method, laser interferometer method and laser Doppler vibrometer method)and indirect measurement(conventional impedance analyzer).The basic principle, measurement characterization, application status and problems were all illustrated in this paper, the advantages/disadvantages of these techniques were compared for piezoelectric applications and the future development of measurement characterization of piezoelectric thin films were predicted.