CAJ | 학술논문

研究了EDTA,NaKC_4H_4O_6以及两者复配后,对Al_2O_3陶瓷表面化学镀铜沉积速率、微观形貌、表面粗糙度和镀液稳定性的影响.结果表明:EDTA为配位剂时,化学镀铜镀速为3.86μm/h,镀层表面粗糙度为0.39 μm,镀层铜微粒形成团聚,均匀性较差;NaKC_4H_4O_6为配位剂时,镀速为4.55μm/h,表面粗糙度为0.46μm,镀层表面有直径达2～5μm的杂质微粒;EDTA和NaKC_4H_4O_6复配使用时,镀速为4.17μm/h,表面粗糙度为0.35μm,铜镀层微观组织致密,铜微粒大小分布均匀,排列紧密,表面平滑、洁净.
연구료EDTA,NaKC_4H_4O_6이급량자복배후,대Al_2O_3도자표면화학도동침적속솔、미관형모、표면조조도화도액은정성적영향.결과표명:EDTA위배위제시,화학도동도속위3.86μm/h,도층표면조조도위0.39 μm,도층동미립형성단취,균균성교차;NaKC_4H_4O_6위배위제시,도속위4.55μm/h,표면조조도위0.46μm,도층표면유직경체2～5μm적잡질미립;EDTA화NaKC_4H_4O_6복배사용시,도속위4.17μm/h,표면조조도위0.35μm,동도층미관조직치밀,동미립대소분포균균,배렬긴밀,표면평활、길정.
The effects of EDTA, NaKC_4H_4O_6 and a compound of the two on the depositing rate, micro-morphology, surface roughness and bath stability of electroless copper plating on the surface of Al_2O_3 ceramic were investigated. The results show that when EDTA is used as sole complexing agent, the plating rate is 3.86 μm/h, the surface roughness of plating layer is 0.39 μm, agglomerated copper particles are formed and the uniformity of plating layer is poorer; when NaKC_4 H_4O_6 used as sole complexing agent, the plating rate and surface roughness are 4.55 μm/h and 0.46 μm, respectively, and some impurity particles with a diameter of 2 ～ 5 μm are observed; and when EDTA and NaKC_4 H_4O_6 are used as a compound complexing agent, the plating rate and surface roughness are 4.17 μm/h and 0.35 μm, respectively, and thus obtained copper coating has a compact micro-structure, a uniform and dense copper particle distribution as well as a smooth and clean surface.