电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2012年
7期
8-10,14
,共4页
胡耀斌%刘心宇%江民红%崔业让
鬍耀斌%劉心宇%江民紅%崔業讓
호요빈%류심우%강민홍%최업양
无铅压电陶瓷%K0.5Na0.5NbO3%显微结构%压电性能
無鉛壓電陶瓷%K0.5Na0.5NbO3%顯微結構%壓電性能
무연압전도자%K0.5Na0.5NbO3%현미결구%압전성능
采用固相烧结法制备了K0.5Na0.5NbO3-LiSbO3-xBi(Fe09Mn01)O3+σKNN-LS-BF9M1)无铅压电陶瓷,研究了不同BF9M1掺杂量(x分别为0,0.002,0.004,0.006,0.008)对所制陶瓷的显微结构、物相组成及电性能的影响.结果表明,少量BF9M1掺杂能有效抑制KNN陶瓷晶粒的生长,促进组织致密化.当x从0增加到0.006时,样品发生正交-四方相变,同时正交-四方相变温度to-t从95℃降低到40℃；另一方面,压电性能得到明显提高、介质损耗有所降低.当x=0.006时,样品具有最好电性能:d33=260pC/N,tanδ =2.03×10-2,kp=51.9％,εr1241,Qm=44.7,tc =345℃,to-t=45℃.
採用固相燒結法製備瞭K0.5Na0.5NbO3-LiSbO3-xBi(Fe09Mn01)O3+σKNN-LS-BF9M1)無鉛壓電陶瓷,研究瞭不同BF9M1摻雜量(x分彆為0,0.002,0.004,0.006,0.008)對所製陶瓷的顯微結構、物相組成及電性能的影響.結果錶明,少量BF9M1摻雜能有效抑製KNN陶瓷晶粒的生長,促進組織緻密化.噹x從0增加到0.006時,樣品髮生正交-四方相變,同時正交-四方相變溫度to-t從95℃降低到40℃；另一方麵,壓電性能得到明顯提高、介質損耗有所降低.噹x=0.006時,樣品具有最好電性能:d33=260pC/N,tanδ =2.03×10-2,kp=51.9％,εr1241,Qm=44.7,tc =345℃,to-t=45℃.
채용고상소결법제비료K0.5Na0.5NbO3-LiSbO3-xBi(Fe09Mn01)O3+σKNN-LS-BF9M1)무연압전도자,연구료불동BF9M1참잡량(x분별위0,0.002,0.004,0.006,0.008)대소제도자적현미결구、물상조성급전성능적영향.결과표명,소량BF9M1참잡능유효억제KNN도자정립적생장,촉진조직치밀화.당x종0증가도0.006시,양품발생정교-사방상변,동시정교-사방상변온도to-t종95℃강저도40℃；령일방면,압전성능득도명현제고、개질손모유소강저.당x=0.006시,양품구유최호전성능:d33=260pC/N,tanδ =2.03×10-2,kp=51.9％,εr1241,Qm=44.7,tc =345℃,to-t=45℃.
