CAJ | 학술논문

提出一种主动式多孔微热沉系统来实现高热流密度电子元器件封装散热的需求，分析了多孔微热沉系统的工作原理和特点。对多孔微热沉进行了高热流密度下的流动与传热实验研究，实验结果表明微热沉在高热流密度加热下能较快达到平衡；微泵驱动循环水流量为5．1cm0／s时，多孔微热沉的散热热量达到200W，散热热流高达100W／cm^2，对应节点温度为55．8℃，系统压降为17．7kPa；Nu数随Re数增加而增加，Re在323时，Nu达到最大值518；随着流量以及加热热量的增加，微热沉平均换热系数增加，其最高换热系数为36．8kW（m2．℃）^-1。多孔微热沉系统能有效解决高热流密度电子元器件的散热问题，提高器件可靠性与使用寿命。
제출일충주동식다공미열침계통래실현고열류밀도전자원기건봉장산열적수구，분석료다공미열침계통적공작원리화특점。대다공미열침진행료고열류밀도하적류동여전열실험연구，실험결과표명미열침재고열류밀도가열하능교쾌체도평형；미빙구동순배수류량위5．1cm0／s시，다공미열침적산열열량체도200W，산열열류고체100W／cm^2，대응절점온도위55．8℃，계통압강위17．7kPa；Nu수수Re수증가이증가，Re재323시，Nu체도최대치518；수착류량이급가열열량적증가，미열침평균환열계수증가，기최고환열계수위36．8kW（m2．℃）^-1。다공미열침계통능유효해결고열류밀도전자원기건적산열문제，제고기건가고성여사용수명。
A novel porous micro heat sink system was presented for dissipating high heat fluxes of electronic devices, and its operational principle and characteristics were analyzed. The flow and heat transfer of porous micro heat sink was investigated by experiment at the condition of high heat fluxes, and the results show that the present heat sink can reach a steady state in a short time. The heat load of 200W （heat flux of 100 W/cm2） is removed by the heat sink, and the coolant pressure drop across the heat sink system is about 17.7kPa and the heater junction temperature is 55.8℃ at the coolant flow rate of 5.1 cm3/s. Nu number of heat sink increases with the increase of Re number, and maximum value of 323 for Nu was achieved at highest Re of 518. The whole heat transfer coefficient of heat sink increases with the increase of coolant flow rate and heat load, and the maximal heat transfer coefficient is 36.8kW.（m2.℃）-1 in the experiment. The micro heat sink has good performance for electronics cooling at high heat fluxes, and it can improve the reliability and life of electronic devices.