天津大学学报(自然科学与工程技术版)
天津大學學報(自然科學與工程技術版)
천진대학학보(자연과학여공정기술판)
JOURNAL OF TIANJIN UNIVERSITY SCIENCE AND TECHNOLOGY
2001年
2期
261-264
,共4页
姚素薇%桂枫%张卫国%冯钊永%窦升鹏
姚素薇%桂楓%張衛國%馮釗永%竇升鵬
요소미%계풍%장위국%풍쇠영%두승붕
电沉积%金属多层膜%纳米
電沉積%金屬多層膜%納米
전침적%금속다층막%납미
分别采用单槽法和双槽法电沉积制备Cu／Ni多层膜．研究了两种电沉积方法制备多层膜的工艺条件，并利用俄歇电子能谱和扫描电子显微镜(SEM)确定镀层结构．通过对比，分析了单槽法和双槽法制备多层膜的优缺点．
分彆採用單槽法和雙槽法電沉積製備Cu／Ni多層膜．研究瞭兩種電沉積方法製備多層膜的工藝條件，併利用俄歇電子能譜和掃描電子顯微鏡(SEM)確定鍍層結構．通過對比，分析瞭單槽法和雙槽法製備多層膜的優缺點．
분별채용단조법화쌍조법전침적제비Cu／Ni다층막．연구료량충전침적방법제비다층막적공예조건，병이용아헐전자능보화소묘전자현미경(SEM)학정도층결구．통과대비，분석료단조법화쌍조법제비다층막적우결점．
In this paper Cu／Ni multilayers were prepared by usingsingle-bath and double-bath methods respectively.The technological conditions were studied,and the multilayer structure was studied by using Auger and SEM.In addition,on the basis of experiment,the single-bath and double-bath methods were compared.
