无机化学学报
無機化學學報
무궤화학학보
JOURNAL OF INORGANIC CHEMISTRY
2005年
3期
331-336
,共6页
曹勇%周钰明%单云%鞠熀先%薛学佳
曹勇%週鈺明%單雲%鞠熀先%薛學佳
조용%주옥명%단운%국엽선%설학가
杂化材料%介孔材料%胶原%红外发射率
雜化材料%介孔材料%膠原%紅外髮射率
잡화재료%개공재료%효원%홍외발사솔
hybrid%mesopore material%collagen%infrared emissivity
利用接枝胶原与介孔二氧化硅制备一种新型生物无机杂化材料.用甲基丙烯酸甲酯为接枝剂对胶原进行共聚改性制得接枝胶原.以正硅酸乙酯为模板,十二烷基三甲基溴化铵为表面活性剂,用一个简单的热处理过程制得介孔二氧化硅.介孔二氧化硅-接枝胶原杂化材料通过超声分散接枝胶原与介孔二氧化硅的混合物制得,其三维结构用X射线衍射表征,晶格参数a,b和c分别为0.68,0.37和1.64 nm,为正交晶型.氮气吸附-解吸等温线显示杂化材料的比表面积可达273 m2·g-1,孔体积为0.13 cm3·g-1,平均孔径3.4 nm,分布窄.该杂化材料在8~14μm波长的红外发射率可低至0.323,在光电子学器件和红外隐身领域具有潜在应用价值.
利用接枝膠原與介孔二氧化硅製備一種新型生物無機雜化材料.用甲基丙烯痠甲酯為接枝劑對膠原進行共聚改性製得接枝膠原.以正硅痠乙酯為模闆,十二烷基三甲基溴化銨為錶麵活性劑,用一箇簡單的熱處理過程製得介孔二氧化硅.介孔二氧化硅-接枝膠原雜化材料通過超聲分散接枝膠原與介孔二氧化硅的混閤物製得,其三維結構用X射線衍射錶徵,晶格參數a,b和c分彆為0.68,0.37和1.64 nm,為正交晶型.氮氣吸附-解吸等溫線顯示雜化材料的比錶麵積可達273 m2·g-1,孔體積為0.13 cm3·g-1,平均孔徑3.4 nm,分佈窄.該雜化材料在8~14μm波長的紅外髮射率可低至0.323,在光電子學器件和紅外隱身領域具有潛在應用價值.
이용접지효원여개공이양화규제비일충신형생물무궤잡화재료.용갑기병희산갑지위접지제대효원진행공취개성제득접지효원.이정규산을지위모판,십이완기삼갑기추화안위표면활성제,용일개간단적열처리과정제득개공이양화규.개공이양화규-접지효원잡화재료통과초성분산접지효원여개공이양화규적혼합물제득,기삼유결구용X사선연사표정,정격삼수a,b화c분별위0.68,0.37화1.64 nm,위정교정형.담기흡부-해흡등온선현시잡화재료적비표면적가체273 m2·g-1,공체적위0.13 cm3·g-1,평균공경3.4 nm,분포착.해잡화재료재8~14μm파장적홍외발사솔가저지0.323,재광전자학기건화홍외은신영역구유잠재응용개치.
A novel hybrid biological-inorganic material was prepared by filling grafted collagen in mesoporous silica structure. The grafting was realized by reaction between collagen and methyl methacrylate monomer. The formation of mesoporous silica precursor using tetraethyl orthosilicate as a template and cetyltrimethylammonium bromide as an assembly surfactant was completed in ammonia system at room temperature. A simple calcination treatment produced the mesoporous silica structure. An ultrasonic dispersion process was employed to immobilize grafted collagen chain in a three-dimensional mesoporous silica structure. The XRD pattern showed the presence of a three-dimensional meso-structure with the a, b, and c parameters of 0.68, 0.37 and 1.64 nm. Nitrogen adtribution. The infrared emissivity of the composite at 8~14μm wavelength was 0.323, which was very low, indicating a potential application of the composite in areas such as photoelectronics and infrared camouflage.