CAJ | 학술논문

热压焊接是连接柔性电路板和刚性电路板的一种焊接工艺,作为微电子表面组装技术领域的新兴制造工艺和重要组成部分,稳定和高效的热压焊接工艺无疑是保证产品良好品质的重要环节。通过统计分析热压焊接的主要失效模式,并从材料、工艺参数及设备进行实验比对和实验设计（DOE）找出各主要失效模式的影响因素及其之间的相互关系,确定最佳工艺参数。
열압한접시련접유성전로판화강성전로판적일충한접공예,작위미전자표면조장기술영역적신흥제조공예화중요조성부분,은정화고효적열압한접공예무의시보증산품량호품질적중요배절。통과통계분석열압한접적주요실효모식,병종재료、공예삼수급설비진행실험비대화실험설계（DOE）조출각주요실효모식적영향인소급기지간적상호관계,학정최가공예삼수。
Hotbar soldering is a key process to connect flexible printed board and rigid printed board in SMT.With the increasingly fierce competition of SMT manufacturing industry and in order to increase efficiency and decrease cost,as a newly developing soldering process,stable and high efficient hotbar soldering become very important to assuring first pass yield and product quality.Analyze the failure mode of hotbar soldering,and get the key factors to impact the process;finally find out the relationship between the failure and the factors by DOE in order to optimize the hotbar process.