功能材料
功能材料
공능재료
JOURNAL OF FUNCTIONAL MATERIALS
2009年
7期
1112-1114,1118
,共4页
蔡志强%朱达川%曹仕秀%涂铭旌
蔡誌彊%硃達川%曹仕秀%塗銘旌
채지강%주체천%조사수%도명정
Cu-Te-Cr合金%时效工艺%硬度%导电率
Cu-Te-Cr閤金%時效工藝%硬度%導電率
Cu-Te-Cr합금%시효공예%경도%도전솔
Cu-Te-Cr alloys%aging process%hardness%conductivity
研究了在不同时效温度下,时效时间对Cu-Te-Cr合金力学性能和电学性能的影响.利用扫描电镜和能谱仪分析了析出相的形貌、组成及其分布.研究表明,随着时效时间的延长,合金硬度和导电率都先快速上升,然后缓慢下降,出现一个类似峰值点.且温度越高,达到峰值所需的时间越短;随着Te含量的增加,合金硬度减小,而导电率则相对提高.这是由于随时效时间的延长和时效温度的提高,合金发生晶粒长大和第二相析出、从而提高合金硬度和导电率;随时效的进一步进行,部分第二相发生重溶,晶粒进一步长大,合金硬度和导电率缓慢下降.
研究瞭在不同時效溫度下,時效時間對Cu-Te-Cr閤金力學性能和電學性能的影響.利用掃描電鏡和能譜儀分析瞭析齣相的形貌、組成及其分佈.研究錶明,隨著時效時間的延長,閤金硬度和導電率都先快速上升,然後緩慢下降,齣現一箇類似峰值點.且溫度越高,達到峰值所需的時間越短;隨著Te含量的增加,閤金硬度減小,而導電率則相對提高.這是由于隨時效時間的延長和時效溫度的提高,閤金髮生晶粒長大和第二相析齣、從而提高閤金硬度和導電率;隨時效的進一步進行,部分第二相髮生重溶,晶粒進一步長大,閤金硬度和導電率緩慢下降.
연구료재불동시효온도하,시효시간대Cu-Te-Cr합금역학성능화전학성능적영향.이용소묘전경화능보의분석료석출상적형모、조성급기분포.연구표명,수착시효시간적연장,합금경도화도전솔도선쾌속상승,연후완만하강,출현일개유사봉치점.차온도월고,체도봉치소수적시간월단;수착Te함량적증가,합금경도감소,이도전솔칙상대제고.저시유우수시효시간적연장화시효온도적제고,합금발생정립장대화제이상석출、종이제고합금경도화도전솔;수시효적진일보진행,부분제이상발생중용,정립진일보장대,합금경도화도전솔완만하강.
Effect of aging time on the mechanical and electrical properties of Cu-Te-Cr alloys was studied at dif-ferent temperature. SEM and EDS were used to analyze the morphologies and composition of precipitations. The results showed that with the aging time being longer, both hardness and conductivity of the alloys increase rap-idly originally, and then decrease, reaching a peak at a certain time which reduces when the aging temperature in-crease. With more content of Te adding, the hardness of Cu-Te-Cr alloy drops, while its conductivity rises rela-tively. This is because grain growth and precipitations happened simultaneously during aging process. But part precipitations dissolved when aging continued, thus leading to decrease of hardness and conductivity.