稀有金属材料与工程
稀有金屬材料與工程
희유금속재료여공정
RARE METAL MATERIALS AND ENGINEERNG
2012年
1期
24-27
,共4页
李先学%郑炳云%许丽梅%吴丹丹%刘宗林%张惠钗
李先學%鄭炳雲%許麗梅%吳丹丹%劉宗林%張惠釵
리선학%정병운%허려매%오단단%류종림%장혜차
纳米银粉%导电胶%硅烷偶联剂%KH-560
納米銀粉%導電膠%硅烷偶聯劑%KH-560
납미은분%도전효%규완우련제%KH-560
nano-silver powders%conductive adhesive%silane coupling agent%KH-560
采用经硅烷偶联剂KH-560表面改性的纳米银粉作为填料,环氧树脂为基体在180℃固化得到银导电胶.借助透射电子显微镜(TEM)、红外光谱(FTIR)、差示扫描量热法(DSC)等测试手段,对改性后纳米银粉和导电胶进行了表征.研究了银粉含量、固化时间对导电胶性能的影响.结果表明:KH-560改性后的纳米银粉平均粒径为20 nm,分散均匀;KH-560以化学键合的方式吸附在纳米银颗粒的表面.银粉含量、固化时间等均会影响导电胶的性能.当银粉含量为55%,固化时间为15 min时,导电胶的体积电阻率达最小值为2.5×10-3Ω·cm.与未做任何表面处理的纳米银粉填充的导电胶相比,KH-560改性后纳米银粉所得导电胶的电导率提高了3-5倍.
採用經硅烷偶聯劑KH-560錶麵改性的納米銀粉作為填料,環氧樹脂為基體在180℃固化得到銀導電膠.藉助透射電子顯微鏡(TEM)、紅外光譜(FTIR)、差示掃描量熱法(DSC)等測試手段,對改性後納米銀粉和導電膠進行瞭錶徵.研究瞭銀粉含量、固化時間對導電膠性能的影響.結果錶明:KH-560改性後的納米銀粉平均粒徑為20 nm,分散均勻;KH-560以化學鍵閤的方式吸附在納米銀顆粒的錶麵.銀粉含量、固化時間等均會影響導電膠的性能.噹銀粉含量為55%,固化時間為15 min時,導電膠的體積電阻率達最小值為2.5×10-3Ω·cm.與未做任何錶麵處理的納米銀粉填充的導電膠相比,KH-560改性後納米銀粉所得導電膠的電導率提高瞭3-5倍.
채용경규완우련제KH-560표면개성적납미은분작위전료,배양수지위기체재180℃고화득도은도전효.차조투사전자현미경(TEM)、홍외광보(FTIR)、차시소묘량열법(DSC)등측시수단,대개성후납미은분화도전효진행료표정.연구료은분함량、고화시간대도전효성능적영향.결과표명:KH-560개성후적납미은분평균립경위20 nm,분산균균;KH-560이화학건합적방식흡부재납미은과립적표면.은분함량、고화시간등균회영향도전효적성능.당은분함량위55%,고화시간위15 min시,도전효적체적전조솔체최소치위2.5×10-3Ω·cm.여미주임하표면처리적납미은분전충적도전효상비,KH-560개성후납미은분소득도전효적전도솔제고료3-5배.
Silver nanoparticles modified by silane coupling agent KH-560 were used as conductive filler to prepare conductive adhesive at 180 ℃ in epoxide resin vehicles.The as-modified Ag nanoparticles and conductive adhesive were characterized by transmission electron microscopy (TEM),Fourier transform infrared spectra (FTIR) and differential scanning calorimetry (DSC).The effects of silver content and curing time on the properties of conductive adhesive were studied.The results show that KH-560 modified Ag powders with a particle size of approximately 20 nm are uniformly dispersed and KH-560 molecules are adsorbed on silver particle surface.Silver content and curing time could influence the properties of conductive adhesive significantly.The bulk resistivity of conductive adhesive with 55 wt% silver nanoparticle and curing time of 15 min reaches a minimal value of 2.5×10-3Ω·cm.Compared with the conductive adhesive filled with unmodified silver nano-powders,the bulk resistivity of conductive adhesive filed with modified silver nano-powders increases by 3-5 times.