电子设计工程
電子設計工程
전자설계공정
ELECTRONIC DESIGN ENGINEERING
2011年
17期
37-40
,共4页
SI%反射%串扰%SSN
SI%反射%串擾%SSN
SI%반사%천우%SSN
SI%reflection%crosstalk%SSN
随着数字电子产品向高速高密度发展，SI问题逐渐成为决定产品性能的因素之一，高速高密度PCB设计必须有效应对SI问题。在PCB级。影响SI的3个主要方面是互联阻抗不连续引起的反射、邻近互联引起的串扰和逻辑器件开关引起的SSN。从高速高密度PCB设计的角度，在介绍SI问题的产生的基础上，着重分析了反射、串扰和SSN的机理、特性及对SI的影响。分析结论对高速高密度PCB设计实践具有参考作用。
隨著數字電子產品嚮高速高密度髮展，SI問題逐漸成為決定產品性能的因素之一，高速高密度PCB設計必鬚有效應對SI問題。在PCB級。影響SI的3箇主要方麵是互聯阻抗不連續引起的反射、鄰近互聯引起的串擾和邏輯器件開關引起的SSN。從高速高密度PCB設計的角度，在介紹SI問題的產生的基礎上，著重分析瞭反射、串擾和SSN的機理、特性及對SI的影響。分析結論對高速高密度PCB設計實踐具有參攷作用。
수착수자전자산품향고속고밀도발전，SI문제축점성위결정산품성능적인소지일，고속고밀도PCB설계필수유효응대SI문제。재PCB급。영향SI적3개주요방면시호련조항불련속인기적반사、린근호련인기적천우화라집기건개관인기적SSN。종고속고밀도PCB설계적각도，재개소SI문제적산생적기출상，착중분석료반사、천우화SSN적궤리、특성급대SI적영향。분석결론대고속고밀도PCB설계실천구유삼고작용。
High-speed and high-density is a striking trend of digital electronic products, SI （signal integrity） has key impacts on performance of the products, and it＇s critically important to fix SI problems in high-speed and high-density PCB designs. At the level of PCB, the three main issues of concern for SI are reflections occurring because of interconnect discontinuities, noise induced by neighbouring connections （crosstalk）,andSSN （simuhaneous switching noise） caused by switehing of the digital devices. On the purpose of high-speed and high-density PCB designs, the root cause of SI problems are introduced, and the mechanisms, characteristics, and effects on SI of the three main issues of concem for SI are analyzed. The discussions and conclusions are useful for guiding the high-speed and high-density PCB design practices.
