CAJ | 학술논문

描述了一种基于斜率传感器的大型硅晶片平面度扫描测量系统.采用二维斜率传感器对晶片表面扫描,以获得表面绕X和Y轴的倾斜度.斜率传感器装在X向滑板上,而晶片固定在可绕Z 轴转动的主轴上.对斜率传感器Y向的输出积分,得到晶片表面各个同心圆上轮廓截面高度.对斜率传感器X向的输出积分,得到晶片表面沿X向的截面轮廓,从而获得各同心圆轮廓之间的关系.构建了一个包括基于自准直原理的小型斜率传感器、气浮主轴、气浮导轨的实验系统,提出一种斜率传感器现场标定方法.用此系统测量了直径300 mm的硅晶片平面度.
묘술료일충기우사솔전감기적대형규정편평면도소묘측량계통.채용이유사솔전감기대정편표면소묘,이획득표면요X화Y축적경사도.사솔전감기장재X향활판상,이정편고정재가요Z 축전동적주축상.대사솔전감기Y향적수출적분,득도정편표면각개동심원상륜곽절면고도.대사솔전감기X향적수출적분,득도정편표면연X향적절면륜곽,종이획득각동심원륜곽지간적관계.구건료일개포괄기우자준직원리적소형사솔전감기、기부주축、기부도궤적실험계통,제출일충사솔전감기현장표정방법.용차계통측량료직경300 mm적규정편평면도.
This paper describes a slope sensor-based scanning system for flatness measurement of large silicon wafers. A two-directional (2-D) slope sensor is used to scan the wafer surface to get 2-D local slopes of the surface about the X- and Y-axes. The slope sensor is mounted on a linear X-carriage and the wafer on a spindle with its rotational axis along the Z-axis. Sectional height profiles of the wafer surface along concentric circles can be obtained from the integration of the Y-outputs of the slope sensor. A sectional profile along the X-axis is obtained from integrating the X-outputs of the slope sensor so that the relationship between the profiles along the concentric circles can be determined. An experimental system, which consists of a compact slope sensor based on laser autocollimation, an air-spindle and an air-slide, is constructed. An in-situ calibration method for the slope sensor is also proposed. The flatness of a large silicon wafer with a diameter of 300 mm is measured in the system.