红外与毫米波学报
紅外與毫米波學報
홍외여호미파학보
JOURNAL OF INFRARED AND MILLIMETER WAVES
2009年
6期
405-409
,共5页
王凯%张永刚%顾溢%李成%李好斯白音%李耀耀
王凱%張永剛%顧溢%李成%李好斯白音%李耀耀
왕개%장영강%고일%리성%리호사백음%리요요
数字梯度超晶格%InP缓冲层%In_xGa_(1-x)As%位错
數字梯度超晶格%InP緩遲層%In_xGa_(1-x)As%位錯
수자제도초정격%InP완충층%In_xGa_(1-x)As%위착
digital graded superlattice%InP buffer layers%In_xGa_(1-x)As%dislocations
采用气态源分子束外延方法生长了三种不同结构的扩展波长(室温下50%截止波长为2.4μm) In_xGa_(1-x)As光电探测器材料,并制成了台面型器件.材料的表面形貌、X射线衍射摇摆曲线及光致发光谱表明,在InAlAs/InGaAs异质界面处生长数字梯度超晶格可以明显提高材料质量;器件在室温下的暗电流结果显示,直径为300μm的器件在反向偏压为10mV时,没有生长超晶格结构的器件暗电流为0.521μA,而生长超晶格结构的器件暗电流降到0.480μA.同时,在生长In_xAl_(1-x)As组分线性渐变缓冲层之前首先生长一层InP缓冲层也有利于改善材料质量和器件性能.
採用氣態源分子束外延方法生長瞭三種不同結構的擴展波長(室溫下50%截止波長為2.4μm) In_xGa_(1-x)As光電探測器材料,併製成瞭檯麵型器件.材料的錶麵形貌、X射線衍射搖襬麯線及光緻髮光譜錶明,在InAlAs/InGaAs異質界麵處生長數字梯度超晶格可以明顯提高材料質量;器件在室溫下的暗電流結果顯示,直徑為300μm的器件在反嚮偏壓為10mV時,沒有生長超晶格結構的器件暗電流為0.521μA,而生長超晶格結構的器件暗電流降到0.480μA.同時,在生長In_xAl_(1-x)As組分線性漸變緩遲層之前首先生長一層InP緩遲層也有利于改善材料質量和器件性能.
채용기태원분자속외연방법생장료삼충불동결구적확전파장(실온하50%절지파장위2.4μm) In_xGa_(1-x)As광전탐측기재료,병제성료태면형기건.재료적표면형모、X사선연사요파곡선급광치발광보표명,재InAlAs/InGaAs이질계면처생장수자제도초정격가이명현제고재료질량;기건재실온하적암전류결과현시,직경위300μm적기건재반향편압위10mV시,몰유생장초정격결구적기건암전류위0.521μA,이생장초정격결구적기건암전류강도0.480μA.동시,재생장In_xAl_(1-x)As조분선성점변완충층지전수선생장일층InP완충층야유리우개선재료질량화기건성능.
The materials of extended wavelength In_xGa_(1-x)As photodetectors (50% cut-off wavelength of 2.4μm at room temperature) with three different structures were grown by using gas source molecular beam epitaxy (GSMBE) and were processed into mesa type photodetectors. Surface morphology, x-ray diffraction rocking curve and photoluminescence measurements show that the quality of materials is obviously improved by using digital graded superlattice at the InAlAs/InGaAs heterointerfaces . The dark current at reverse bias of 10mV for the 300μm-diameter mesa type photodetectors without digital graded superlattice is 0.521μA at room temperature, however it is reduced to 0.480μA for photodetectors with digital graded superlattice. Besides, the growth of an InP buffer layer between InP substrate and In_xAl_(1-x)As linear graded buffer layer is also beneficial to the material quality and device performance.