CAJ | 학술논문

为减小微流控芯片的脱模缺陷,设计了4种顶杆式脱模方案.采用有限元法模拟了4种脱模方案下微流控芯片的脱模过程.模拟结果显示,顶杆的数目和位置对微流控芯片的脱模应力具有重要影响,采用第1种脱模方案时,微流控芯片的最大脱模应力达到123 MPa,超过了微流控芯片所用聚甲基丙烯酸甲酯的强度极限110 MPa,微流控芯片在脱模后发生断裂;其它3种脱模方案下微流控芯片均能顺利脱出,且脱模应力均小于强度极限.为了克服顶杆脱模方式下芯片易出现表面质量差的缺陷,设计了一种新型的气动脱模装置,并通过有限元法模拟了微流控芯片在此装置下脱模应力的分布,证实了该装置的有效性及优越性.
위감소미류공심편적탈모결함,설계료4충정간식탈모방안.채용유한원법모의료4충탈모방안하미류공심편적탈모과정.모의결과현시,정간적수목화위치대미류공심편적탈모응력구유중요영향,채용제1충탈모방안시,미류공심편적최대탈모응력체도123 MPa,초과료미류공심편소용취갑기병희산갑지적강도겁한110 MPa,미류공심편재탈모후발생단렬;기타3충탈모방안하미류공심편균능순리탈출,차탈모응력균소우강도겁한.위료극복정간탈모방식하심편역출현표면질량차적결함,설계료일충신형적기동탈모장치,병통과유한원법모의료미류공심편재차장치하탈모응력적분포,증실료해장치적유효성급우월성.
In an effort to find the proper demolding mechanism and reduce demolding defects,four demolding mechanisms with ejector pins were designed and the demolding process of microfluidic chip for each of the four mechanisms was simulated using finite element method.The simulation results showed that the number and location of ejector pins had significant influence on the demolding stress of microfluidic chip.In the first demolding mechanism, the maximum demolding stress reached up to 123 MPa,exceeding the strength limit of 110 MPa of PMMA,and rupture in microfluidic chip was observed after demolding.For the other three mechanisms, the microfluidic chip was successfully demolded with demolding stress smaller than the strength limit. A new pneumatic demolding device was designed in view of demolding problems such as poor surface quality and warpage caused by traditional demolding mechanisms.Demolding stress distribution of microfluidic chip was simulated using finite element method and the results verified the effectiveness and superiority of the proposed demolding device.