冶金分析
冶金分析
야금분석
METALLURGICAL ANALYSIS
2005年
2期
65-68
,共4页
氢化物发生%电感耦合等离子体发射光谱分析%干扰
氫化物髮生%電感耦閤等離子體髮射光譜分析%榦擾
경화물발생%전감우합등리자체발사광보분석%간우
利用气动雾化氢化物装置,选择5 g/L硫脲+5 g/L抗坏血酸+2 g/L碘化钾作为有效的还原抑制剂,建立了分析As,Sn,Pb,Sb,Bi的方法.在选定的条件下测得As,Sn,Pb,Sb,Bi检出限分别为0.006 1,0.083 6,0.070 4,0.007 3,0.020 6 μg/mL.
利用氣動霧化氫化物裝置,選擇5 g/L硫脲+5 g/L抗壞血痠+2 g/L碘化鉀作為有效的還原抑製劑,建立瞭分析As,Sn,Pb,Sb,Bi的方法.在選定的條件下測得As,Sn,Pb,Sb,Bi檢齣限分彆為0.006 1,0.083 6,0.070 4,0.007 3,0.020 6 μg/mL.
이용기동무화경화물장치,선택5 g/L류뇨+5 g/L항배혈산+2 g/L전화갑작위유효적환원억제제,건립료분석As,Sn,Pb,Sb,Bi적방법.재선정적조건하측득As,Sn,Pb,Sb,Bi검출한분별위0.006 1,0.083 6,0.070 4,0.007 3,0.020 6 μg/mL.
