CAJ | 학술논문

为提高三倍频光学元件的表面损伤阈值,采用了不同方式对石英基片进行酸蚀刻,利用原子力显微镜观测了基片蚀刻前后的表面微观形貌,并在激光损伤测量装置上进行了R:1方式的阈值测试,比较分析了蚀刻前后基片激光损伤阈值和表面形貌的变化,并比较了不同抛光质量石英基片蚀刻效果的差异.通过实验研究,总结了不同蚀刻方式的优缺点,研究表明酸蚀刻法可以有效提高石英基片激光损伤阈值.
위제고삼배빈광학원건적표면손상역치,채용료불동방식대석영기편진행산식각,이용원자력현미경관측료기편식각전후적표면미관형모,병재격광손상측량장치상진행료R:1방식적역치측시,비교분석료식각전후기편격광손상역치화표면형모적변화,병비교료불동포광질량석영기편식각효과적차이.통과실험연구,총결료불동식각방식적우결점,연구표명산식각법가이유효제고석영기편격광손상역치.
In order to improve the laser damage thresholds of silica substrates,wet etching is used in buffered hydrogen fluoride solution with different processings.The surface appearance of silica substrates after wet etching is observed and different polishing quality on the damage behavior of silica substrates is studied.The advantages and disadvantages among different processings are summarized.The research shows that wet etching can improve the laser damage threshold of silica substrates.