CAJ | 학술논문

以硝酸-磺酸型退锡剂为基础配方,研制了一种脱除废旧电路板表面残留焊锡的剥离液.该剥离液以硝酸为氧化剂,氨基磺酸为稳定剂,苯并三氮唑为铜的缓蚀剂.实验结果表明:剥离液的最佳配比为硝酸浓度3 mol/L,氨基磺酸浓度0.4 mol/L,苯并三氮唑浓度0.08 mol/L;每升剥离液可处理3.5 kg废旧电路板,处理后电路板中的铅离子含量降至100 mg/kg以下.该剥离液处理后的电路板表面的铜箔保持完好,基本没有被剥离液浸蚀.
이초산-광산형퇴석제위기출배방,연제료일충탈제폐구전로판표면잔류한석적박리액.해박리액이초산위양화제,안기광산위은정제,분병삼담서위동적완식제.실험결과표명:박리액적최가배비위초산농도3 mol/L,안기광산농도0.4 mol/L,분병삼담서농도0.08 mol/L;매승박리액가처리3.5 kg폐구전로판,처리후전로판중적연리자함량강지100 mg/kg이하.해박리액처리후적전로판표면적동박보지완호,기본몰유피박리액침식.
A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid- sulfonic acid type tin stripper. The experimental results show that: The optimum compositions are as follows: nitric acid concentration 3 mol/L, sulfamic acid concentration 0.4 mol/L, benzotriazole concentration 0.08 mol/L; 1 L stripper can be used to treat 3.5 kg waste printed circuit boards, and the content of lead ions on the treated waste printed circuit boards will decrease to below 100 mg/kg. The copper foil on the surface of the treated waste printed circuit boards is undamaged and essentially not corroded.