CAJ | 학술논문

介绍了无铅焊料和无铅元器件等相关技术和当前的基本应用情况。对无铅工艺在军用电子产品中的应用进行了初步研究和探讨,对需要引起格外关注的如湿度敏感等级和焊端镀层等影响可靠性的因素进行了阐述,确定了当前条件下可用于军用电子产品印制板组件无铅有铅混装工艺的相关方法和参数。对相关工艺参数条件下完成的印制板组件进行了焊点加速疲劳寿命试验,通过焊点检测和试验表明该工艺方法具有较高的可靠性。
개소료무연한료화무연원기건등상관기술화당전적기본응용정황。대무연공예재군용전자산품중적응용진행료초보연구화탐토,대수요인기격외관주적여습도민감등급화한단도층등영향가고성적인소진행료천술,학정료당전조건하가용우군용전자산품인제판조건무연유연혼장공예적상관방법화삼수。대상관공예삼수조건하완성적인제판조건진행료한점가속피로수명시험,통과한점검측화시험표명해공예방법구유교고적가고성。
Introduce the technologies of lead-free solder and lead-free components and their applications.The application of lead-free solder in military electronic product is discussed,especially factors which affect reliability,such as Moisture Sensitive Level（MSL） and coat of soldering end surface.According to the present situation,the mix-assembling process and parameters available for the PCB assembly with both lead and lead-free components are determined.This process is proved to be reliable after the soldering point accelerated fatigue test of the PCB assembly which is assembled with the determined process and parameters.