表面技术
錶麵技術
표면기술
SURFACE TECHNOLOGY
2010年
1期
71-73,80
,共4页
双镀层%化学镀%电镀%镀镍%热处理
雙鍍層%化學鍍%電鍍%鍍鎳%熱處理
쌍도층%화학도%전도%도얼%열처리
Duplex coating%Electroless deposition%Electrodeposion%Ni plating%Heat treatment
在镁合金表面先化学镀Ni-P层,再电镀Ni,获得高耐蚀性Ni-P/Ni镀层,并用静态腐蚀浸泡法研究了化学镀时间和电镀时间对所得镀层在5%NaCl溶液中的耐蚀性能的影响.结果表明,先化学镀40 min,再电镀15 min所得的Ni-P/Ni镀层具备高耐蚀性能,电化学测试结果表明,此种镀层在酸性和碱性溶液中都具有较好的耐蚀性能.在200 ℃热处理24 h后,Ni-P/Ni镀层的耐蚀性提高,同时外层Ni层的显微硬度从HV460增大到HV550.镀层侧面的SEM照片显示,镀层均匀致密,与基体结合良好,化学镀层与电镀层之间没有明显的界限.
在鎂閤金錶麵先化學鍍Ni-P層,再電鍍Ni,穫得高耐蝕性Ni-P/Ni鍍層,併用靜態腐蝕浸泡法研究瞭化學鍍時間和電鍍時間對所得鍍層在5%NaCl溶液中的耐蝕性能的影響.結果錶明,先化學鍍40 min,再電鍍15 min所得的Ni-P/Ni鍍層具備高耐蝕性能,電化學測試結果錶明,此種鍍層在痠性和堿性溶液中都具有較好的耐蝕性能.在200 ℃熱處理24 h後,Ni-P/Ni鍍層的耐蝕性提高,同時外層Ni層的顯微硬度從HV460增大到HV550.鍍層側麵的SEM照片顯示,鍍層均勻緻密,與基體結閤良好,化學鍍層與電鍍層之間沒有明顯的界限.
재미합금표면선화학도Ni-P층,재전도Ni,획득고내식성Ni-P/Ni도층,병용정태부식침포법연구료화학도시간화전도시간대소득도층재5%NaCl용액중적내식성능적영향.결과표명,선화학도40 min,재전도15 min소득적Ni-P/Ni도층구비고내식성능,전화학측시결과표명,차충도층재산성화감성용액중도구유교호적내식성능.재200 ℃열처리24 h후,Ni-P/Ni도층적내식성제고,동시외층Ni층적현미경도종HV460증대도HV550.도층측면적SEM조편현시,도층균균치밀,여기체결합량호,화학도층여전도층지간몰유명현적계한.
The high corrosion resistance Ni-P/Ni duplex coating was deposited on the surface of magnesium alloys by electroless depositing Ni-P and following electrodepositing Ni. The effect of electroless deposition and electrodeposition time on the corrosion resistance of the duplex coating was investigated by static corrosion immersion in the 5% NaCl aqueous solution .the results indicate that only the electroless deposition time no less then 40 min, the duplex coating get high corrosion resistance. The observations of linear sweep polarization curve experiments indicate that both in the acidic solution and alkalic solution the duplex coating has good corrosion resistance. After heat treatment at 200 ℃ for 24 hours the corrosion resistance of the Ni-P/Ni duplex coating increases and the microhardness of the eletrodeposition exterior Ni layer increases from HV460 to HV550. The SEM observation of the cross section of the duplex coating indicates that the coating is connected well to the magnesium substrate and there isn't obviously interface between the Ni-P layer and Ni layer.