CAJ | 학술논문

磨削工艺被广泛应用于大直径Si衬底的制备中,而由磨削带来的Si片表面损伤及形貌对后续加工有较大的影响.利用扫描电子显微镜、粗糙度仪、喇曼光谱仪等工具对经过2000#、3000#、8000#砂轮磨削的Si片表面损伤层厚度及表面形貌进行了一系列测试,通过对测试数据的分析,得到了不同粒径磨削砂轮的优缺点,在此基础上提出了将传统单步磨削工艺优化为2000#磨削+8000#磨削的两步加工工艺,该工艺既可以保证较高的Si片表面质量,又具有较高的生产效率.
마삭공예피엄범응용우대직경Si츤저적제비중,이유마삭대래적Si편표면손상급형모대후속가공유교대적영향.이용소묘전자현미경、조조도의、나만광보의등공구대경과2000#、3000#、8000#사륜마삭적Si편표면손상층후도급표면형모진행료일계렬측시,통과대측시수거적분석,득도료불동립경마삭사륜적우결점,재차기출상제출료장전통단보마삭공예우화위2000#마삭+8000#마삭적량보가공공예,해공예기가이보증교고적Si편표면질량,우구유교고적생산효솔.
Grinding is used widely in wafer manufacture, surface damage and surface topography caused by grinding have great effect on latter process. SEM, roughness instrument and Raman spectroscopy were used for testing the damage layer thickness and surface topography of grinding wafer by 2000 # , 3000 # and 8000 # grinding wheel. The analysis of testing data shows the strongpoint and shortcoming of three kinds of grinding wheel. Based on the analysis, optimize grinding process from conventional one step grinding to two steps grinding (2000# grinding+ 8000 # grinding) , both high surface quality and high throughput are got by this new process.