CAJ | 학술논문

介绍了微波印制电路板制造工艺中的钻孔、孔金属化和图形制作等主要步骤以及电阻集成的方法.通过在微波印制电路板基材表面涂覆低介电常数的材料,改变了基材表面形貌和特性,采用薄膜工艺在微波印制电路板上集成了30～50 (/(的NiCr电阻.最后简要介绍了微波多层印制电路新技术.
개소료미파인제전로판제조공예중적찬공、공금속화화도형제작등주요보취이급전조집성적방법.통과재미파인제전로판기재표면도복저개전상수적재료,개변료기재표면형모화특성,채용박막공예재미파인제전로판상집성료30～50 (/(적NiCr전조.최후간요개소료미파다층인제전로신기술.
The main steps such as the drill, the metalized via bole and the manufacturing graph of manufacturing process of microwave PCB and the methods of resistance integration were introduced. Through modifying the surface morphology and character of the microwave PCB material by coating low permittivity material, the NiCr resistances of 30～50 W/e were integrated on the microwave PCB by thin film technologies. Multilayer microwave PCB technology was introduced briefly.