CAJ | 학술논문

介绍了固态放大器的I/O端同轴连接器内导体与多种印制电路板上微带线的接连方式和焊接应力分析。建立了常用的连接器内导体与印制电路板接连焊接的模型,并模拟了端口的微波性能,给出了I/O端口低应力接连挠性焊接的方法。应用该工艺方法装联的固态放大器I/O端口性能,测试结果与仿真结果基本一致;经环境适应性试验,无热应力和疲劳失效,符合航天电子产品使用要求。
개소료고태방대기적I/O단동축련접기내도체여다충인제전로판상미대선적접련방식화한접응력분석。건립료상용적련접기내도체여인제전로판접련한접적모형,병모의료단구적미파성능,급출료I/O단구저응력접련뇨성한접적방법。응용해공예방법장련적고태방대기I/O단구성능,측시결과여방진결과기본일치;경배경괄응성시험,무열응력화피로실효,부합항천전자산품사용요구。
Introduce connection-mode of solid-state amplifier I/O port coaxial connector’s inner conductor with a variety of PCB board microstrip line,as well as welding stress analysis.Build a common weld model for connecting connector’s inner conductor with the PCB board,simulate the microwave performance of the port,and provide methods for I/O port low-stress connection flexible welding.The test result of performance of the I/O port assembled with methods provided is basically the same with the simulation result.The I/O port also shows no thermal stress and fatigue failure in the environmental suitability test and meets the requirements of the space navigation electronic products.