CAJ | 학술논문

研究对比了BGA/SAC305/Cu双界面焊点和SAC305/Cu单界面焊点在150℃条件下经过不同时间的等温时效后界面化合物的形态,并对BGA/SAC305/Cu和SAC305/Cu焊点内部组织进行了观察。试验结果表明：随着时效时间的增加,焊点界面化合物的厚度逐渐增加,表面趋于平坦,且SAC305/Cu单界面焊点出现了明显的Cu3Sn层。
연구대비료BGA/SAC305/Cu쌍계면한점화SAC305/Cu단계면한점재150℃조건하경과불동시간적등온시효후계면화합물적형태,병대BGA/SAC305/Cu화SAC305/Cu한점내부조직진행료관찰。시험결과표명：수착시효시간적증가,한점계면화합물적후도축점증가,표면추우평탄,차SAC305/Cu단계면한점출현료명현적Cu3Sn층。
Study the IMCs morphology of BGA/SAC305/Cu and SAC305/Cu solder joints on PCB side after aging,and also survey the inner microstructure.The test results show that the thickness of IMCs will increase gradually with the aging time,and the interface tends to be smooth.There is obvious Cu3Sn layer on the SAC305/Cu solder joint.