CAJ | 학술논문

发光二极管是一类可直接将电能转化为可见光和热等辐射能的发光器件.随着亮度和功率的不断提高,封装材料成为制约LED进入照明领域的关键技术之一.针对LED对封装材料的性能要求,综述了LED封装材料种类、特点及发展现状,并重点介绍了环氧和有机硅材料的应用研究进展.
발광이겁관시일류가직접장전능전화위가견광화열등복사능적발광기건.수착량도화공솔적불단제고,봉장재료성위제약LED진입조명영역적관건기술지일.침대LED대봉장재료적성능요구,종술료LED봉장재료충류、특점급발전현상,병중점개소료배양화유궤규재료적응용연구진전.
LED is the abbreviation of light emitting diode,which is a kind of semiconductor materials that can transform electfical energy into visible light.With the improvement of LED brightness and efficiency,the perparation of the encapsulation materials become one of the key technology which restrict the LED to enter the lighting field.Hence, this article summarized the types.characteristics and development of LED encapsulation materials aiming at the the performanee requirements of LED packaging materials,especially the epoxy and silicone materials.