材料保护
材料保護
재료보호
MATERIALS PROTECTION
2010年
3期
21-23
,共3页
腐蚀%还原茵%硫酸盐%铜材%钙离子%极化曲线%阻抗
腐蝕%還原茵%硫痠鹽%銅材%鈣離子%極化麯線%阻抗
부식%환원인%류산염%동재%개리자%겁화곡선%조항
corrosion%reducing bacteria%sulfate%copper%Ca2+%polarization curves%impedance
微生物对铜材及其合金有腐蚀,硫酸还原茵是引起微生物腐蚀的茵种之一,过去对此研究不够.采用极化曲线和电化学交流阻抗谱技术考察了在0,200,500,800 mg/L Ca2+培养基中培养2,3,4,5,6 d后的硫酸盐还原茵茵液对铜材的腐蚀作用.结果表明:在200mg/ Ca2+培养基中培养6 d后硫酸盐还原茵茵液对铜电极的腐蚀作用最弱,Ca2+浓度继续增加,铜电极腐蚀加速;0,200 mg/L Ca2+茵液培养的前3 d对铜电极有较明显的腐蚀作用,而后期则对铜电极有缓蚀作用;Ca2+浓度继续增加,在培养的6 d内均不同程度地加剧铜电极的腐蚀.
微生物對銅材及其閤金有腐蝕,硫痠還原茵是引起微生物腐蝕的茵種之一,過去對此研究不夠.採用極化麯線和電化學交流阻抗譜技術攷察瞭在0,200,500,800 mg/L Ca2+培養基中培養2,3,4,5,6 d後的硫痠鹽還原茵茵液對銅材的腐蝕作用.結果錶明:在200mg/ Ca2+培養基中培養6 d後硫痠鹽還原茵茵液對銅電極的腐蝕作用最弱,Ca2+濃度繼續增加,銅電極腐蝕加速;0,200 mg/L Ca2+茵液培養的前3 d對銅電極有較明顯的腐蝕作用,而後期則對銅電極有緩蝕作用;Ca2+濃度繼續增加,在培養的6 d內均不同程度地加劇銅電極的腐蝕.
미생물대동재급기합금유부식,류산환원인시인기미생물부식적인충지일,과거대차연구불구.채용겁화곡선화전화학교류조항보기술고찰료재0,200,500,800 mg/L Ca2+배양기중배양2,3,4,5,6 d후적류산염환원인인액대동재적부식작용.결과표명:재200mg/ Ca2+배양기중배양6 d후류산염환원인인액대동전겁적부식작용최약,Ca2+농도계속증가,동전겁부식가속;0,200 mg/L Ca2+인액배양적전3 d대동전겁유교명현적부식작용,이후기칙대동전겁유완식작용;Ca2+농도계속증가,재배양적6 d내균불동정도지가극동전겁적부식.
Sulfate- reducing bacteria solutious were cultivated from solutions with different concentrations of Ca2+ (0,200,500,800 mg/L) for different durations (1, 2,3, 4, 5,6 d). The effect of the resulting bacteria solutions on the corrosion behavior of copper was investigated by measuring poten-tiodynamic polarization curves and electrochemical impedance spectra. Results show that the sulfate- reducing bacteria solution cultivated in the solution containing 200 mg/L Ca2+ for 6 d has the best inhibition effect for Cu electrode, and corrosion of the Cu electrode is accelerated with increasing concentration of Ca2+.After being cultivated for 3 d in the solution containing 0 mg/L and 200 mg/L Ca2+ , the resulting bacteria solutions accelerated the corrosion of copper, but those bacteria solutions cultivated in the follow-up days had significant corrosion inhibition effect for the Cu electrode. Besides, the bacteria solutions cultivated for 6 d in the solutions with high concentration of Ca2+ ( above 200 mg/L) always accelerated the corrosion of the Cu electrode.