CAJ | 학술논문

化学镀厚铜不需要电镀设备和昂贵的阳极材料，沉铜后经防氧化处理即可进入图形转移工序，然后直接进行图形电镀，缩短了生产流程，有着非常广泛的应用。但由于化学镀厚铜沉积时间长，镀层较厚，在生产中如果参数控制不到住，容易出现镀层起皮和结合力差等问题。文中对某厂在化学镀厚铜过程中出现的一次孔口起皮故障进行了原因分析和跟踪，提出了预防出现类似问题的方法。
화학도후동불수요전도설비화앙귀적양겁재료，침동후경방양화처리즉가진입도형전이공서，연후직접진행도형전도，축단료생산류정，유착비상엄범적응용。단유우화학도후동침적시간장，도층교후，재생산중여과삼수공제불도주，용역출현도층기피화결합력차등문제。문중대모엄재화학도후동과정중출현적일차공구기피고장진행료원인분석화근종，제출료예방출현유사문제적방법。
There is no need of plating equipments and expensive anode for electroless thick copper plating The treated copper-clad board can be transferred to the pattern plating process after anti-oxidation treatment and image transfer process, so, the process flow is shortened. The electroless thick copper plating process has been widely utilized because of the above advantages. But the fault of peeling layer and poor adhesion may appear if the operation parameters can not be exactly controlled in consequence of the process has long deposition time and thick layer. In this article, the cause was analyzed of the fault of peeling layer appeared during electroless thick copper plating process. The methods to prevent similar problems were offered.