印制线路板内层黑氧化液的研制
인제선로판내층흑양화액적연제
The Development of Chemicals for the Black Oxide Process in Multilayer Circuit Boards
  • 万方数据
    广东化工 엄동화공
    GUANGDONG CHEMICAL INDUSTRY
    2009年 7期 19-20,65 ,共3页

    黄淋佳%张小春%陈伟建%叶瑾亮

    황림가%장소춘%진위건%협근량

    多层印制线路板%黑氧化%黑化层厚度 多層印製線路闆%黑氧化%黑化層厚度
    다층인제선로판%흑양화%흑화층후도
    multiplayercireuitboards%black oxide%thickness of black-oxide
    文章介绍了多层印制线路板制作内层氧化工艺的不足,通过分析铜面氧化机理,严格筛选多种添加剂,研制出高品质的印制线路板内层黑氧化液,经此黑氧化液形成的黑氧化层致密、均匀,与树脂结合产生高的抗剥离强度.
    문장개소료다층인제선로판제작내층양화공예적불족,통과분석동면양화궤리,엄격사선다충첨가제,연제출고품질적인제선로판내층흑양화액,경차흑양화액형성적흑양화층치밀、균균,여수지결합산생고적항박리강도.
    The paper introduced the deficiency of black oxide in the multiplayer circuit boards, and the mechanism of the copper oxidation was analyzed. The high quality of the black oxide chemicals were produced by designing the compositions and strict choice of series additives. The copper surface treated by the chemicals was dense, uniform and resin combined with high anti-peel strength.
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