印制板翘曲度分析及其测试方法
인제판교곡도분석급기측시방법
PCB warpage analysis and test methods
  • 万方数据
    印制电路信息 인제전로신식
    PRINTED CIRCUIT INFORMATION
    2012年 1期 56-60 ,共5页

    陶仁君%孙忠新%董丽玲

    도인군%손충신%동려령

    翘曲%弓曲%扭曲 翹麯%弓麯%扭麯
    교곡%궁곡%뉴곡
    warpage%bow%twist
    翘曲是印制板和有机基板的常见问题之一,介绍了印制板翘曲测试方法,并通过三个具体的翘曲测试案例,分析了其产生的原因和造成的影响。
    교곡시인제판화유궤기판적상견문제지일,개소료인제판교곡측시방법,병통과삼개구체적교곡측시안례,분석료기산생적원인화조성적영향。
    PCB and organic substrate warpage is one of the common problem.This paper describes the PCB warpage in the test method based on the analysis of warping through three specific test cases,and analyzes its causes and impact.
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