CAJ | 학술논문

文章主要分析了PCB制造过程中阻焊断桥问题的产生原因，介绍了使用鱼骨图和难度一效益图查找关键影响因素的方法，通过试验，探索出油墨性能，曝光能量，显影速度和压力这几个因素的最佳控制范围。
문장주요분석료PCB제조과정중조한단교문제적산생원인，개소료사용어골도화난도일효익도사조관건영향인소적방법，통과시험，탐색출유묵성능，폭광능량，현영속도화압력저궤개인소적최가공제범위。
Solder mask broken bridges often bother PCB manufacturers, so it is necessary to find out solutions to solve the problem. By experiment, this paper finds out that fishbone and difficulty-effect diagram are the effective ways to get the main factors which cause the problem. By analyzing the main factors, this paper learns that solder resist ink performance, exposure energy, develop speed and pressure must be well controlled within a certain scope during manufacturing.