电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2011年
10期
23-27
,共5页
虞致国%魏斌%万书芹%黄召军%陈子逢
虞緻國%魏斌%萬書芹%黃召軍%陳子逢
우치국%위빈%만서근%황소군%진자봉
无线传感器网络节点%低功耗%多传感器模块%接口设计
無線傳感器網絡節點%低功耗%多傳感器模塊%接口設計
무선전감기망락절점%저공모%다전감기모괴%접구설계
wireless sensor nodes%low power%multi-sensor module%interface design
设计了一种面向多传感器模块接入的低功耗无线传感器节点。该节点基于超低功耗Zigbee单片机MC13224V设计，由射频模块、配置电路和电源系统等组成。根据无线通信系统的特点设计了系统的软硬件，详细阐述了硬件设计、软件设计及性能测试方法。测试结果证明：在3V电源供电条件下，休眠时电流小于11μA，实现了低功耗设计的目的。
設計瞭一種麵嚮多傳感器模塊接入的低功耗無線傳感器節點。該節點基于超低功耗Zigbee單片機MC13224V設計，由射頻模塊、配置電路和電源繫統等組成。根據無線通信繫統的特點設計瞭繫統的軟硬件，詳細闡述瞭硬件設計、軟件設計及性能測試方法。測試結果證明：在3V電源供電條件下，休眠時電流小于11μA，實現瞭低功耗設計的目的。
설계료일충면향다전감기모괴접입적저공모무선전감기절점。해절점기우초저공모Zigbee단편궤MC13224V설계，유사빈모괴、배치전로화전원계통등조성。근거무선통신계통적특점설계료계통적연경건，상세천술료경건설계、연건설계급성능측시방법。측시결과증명：재3V전원공전조건하，휴면시전류소우11μA，실현료저공모설계적목적。
The design of low power wireless sensor nodes for multi-sensor module is proposed. The sensor node is based on the ZigBee MCU MC13224V, and is composed of the RF communication mode, configuration circuit, power management and etc.. In accordance with the features of wireless communication system, the software and hardware of the system are designed. The hardware design, software design and performance test mode is described in detail. Test results show that, with the 3V power supply, the current o f sleep mode is less than 11 μ A.
