微电子学
微電子學
미전자학
MICROELECTRONICS
2010年
1期
122-125
,共4页
随动强化模型%铜互连%热应力%可靠性
隨動彊化模型%銅互連%熱應力%可靠性
수동강화모형%동호련%열응력%가고성
Elastic-plastic model%Cu interconnect%Thermal stress%Reliability
基于Cu的随动强化模型,用二维有限元分析方法,模拟分析了不同互连宽度对Cu互连热应力分布的影响.研究发现,当互连尺寸减小到一定宽度后,静水应力先减小,后略有增加;随线宽的减小,等效塑性应变的最大值逐渐减小,塑性应变最大值的位置由Cu互连上界面处转向Cu互连上界面边角处,而发生等效塑性应变的区域先减小后增加.讨论了在不同Cu互连结构条件下,应力状态和塑性应变对Cu互连可靠性的影响.
基于Cu的隨動彊化模型,用二維有限元分析方法,模擬分析瞭不同互連寬度對Cu互連熱應力分佈的影響.研究髮現,噹互連呎吋減小到一定寬度後,靜水應力先減小,後略有增加;隨線寬的減小,等效塑性應變的最大值逐漸減小,塑性應變最大值的位置由Cu互連上界麵處轉嚮Cu互連上界麵邊角處,而髮生等效塑性應變的區域先減小後增加.討論瞭在不同Cu互連結構條件下,應力狀態和塑性應變對Cu互連可靠性的影響.
기우Cu적수동강화모형,용이유유한원분석방법,모의분석료불동호련관도대Cu호련열응력분포적영향.연구발현,당호련척촌감소도일정관도후,정수응력선감소,후략유증가;수선관적감소,등효소성응변적최대치축점감소,소성응변최대치적위치유Cu호련상계면처전향Cu호련상계면변각처,이발생등효소성응변적구역선감소후증가.토론료재불동Cu호련결구조건하,응력상태화소성응변대Cu호련가고성적영향.
2-dimensional finite element analysis was used to analyze effect of different line widths on stress distribution with elastic-plastic model. It was found that, when the line geometry decreased to a certain width, hydrostatic stress firstly decreased and then increased a little. With decreasing line width, the maximum equivalent plastic strain gradually decreased and the location was turned from the upper interface to the corner of the upper interface in copper interconnects, while the area where equivalent plastic strain occured decreased and then increased. Effects of stress state and plastic strain on reliability of Cu interconnects in different Cu interconnect structures were discussed.