电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2009年
11期
52-55
,共4页
复合材料%金刚石%玻璃%热导率%化学镀铜%电子封装
複閤材料%金剛石%玻璃%熱導率%化學鍍銅%電子封裝
복합재료%금강석%파리%열도솔%화학도동%전자봉장
composite material%diamond%glass%thermal conductivity%electroless copper plating%electronic packaging
首先对金刚石颗粒进行化学镀Cu,并控制氧化,从而在金刚石颗粒表面获得Cu-Cu_2O复合结构.然后,在800 ℃无压烧结制备了金刚石/玻璃复合材料,观察了其表面和界面形貌,并测定了其相对密度和热导率.结果表明,通过对镀Cu金刚石的控制氧化,明显改善了玻璃对金刚石颗粒表面的润湿性,避免了玻璃对金刚石颗粒表面的侵蚀,提高了复合材料的热导率;复合材料的热导率随金刚石含量的增加而增加,当金刚石质量分数为70%时,热导率最高达到了14.420 W/(m·K).
首先對金剛石顆粒進行化學鍍Cu,併控製氧化,從而在金剛石顆粒錶麵穫得Cu-Cu_2O複閤結構.然後,在800 ℃無壓燒結製備瞭金剛石/玻璃複閤材料,觀察瞭其錶麵和界麵形貌,併測定瞭其相對密度和熱導率.結果錶明,通過對鍍Cu金剛石的控製氧化,明顯改善瞭玻璃對金剛石顆粒錶麵的潤濕性,避免瞭玻璃對金剛石顆粒錶麵的侵蝕,提高瞭複閤材料的熱導率;複閤材料的熱導率隨金剛石含量的增加而增加,噹金剛石質量分數為70%時,熱導率最高達到瞭14.420 W/(m·K).
수선대금강석과립진행화학도Cu,병공제양화,종이재금강석과립표면획득Cu-Cu_2O복합결구.연후,재800 ℃무압소결제비료금강석/파리복합재료,관찰료기표면화계면형모,병측정료기상대밀도화열도솔.결과표명,통과대도Cu금강석적공제양화,명현개선료파리대금강석과립표면적윤습성,피면료파리대금강석과립표면적침식,제고료복합재료적열도솔;복합재료적열도솔수금강석함량적증가이증가,당금강석질량분수위70%시,열도솔최고체도료14.420 W/(m·K).
Diamond particles were electroless plated with copper firstly. After a controlled oxidation process, the Cu-Cu_2O structure formed on the surface of diamond particles. Then diamond/glass composite materials were prepared through pressureless sintering at 800 ℃. The surface and interface morphology of prepared composite materials were observed, and the relative density and thermal conductivity were measured. The results show that the controlled oxidation significantly improves the wettability while avoids the erosion of molten glass to the surface of diamond particles. Therefore, the thermal conductivity of the composite materials increases. The thermal conductivity of composite materials increases with increasing diamond content and reaches the maximum value of 14.420 W/(m·K) when the mass faction of diamond is 70%.