电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2009年
7期
21-24,41
,共5页
点胶机%大元件%底部填充%瞬时温度
點膠機%大元件%底部填充%瞬時溫度
점효궤%대원건%저부전충%순시온도
Dispense tool%Large device%Underfill%Transient thermat
微电子组装的大部份工艺开发都要求将元件做到更小,以便在尺寸日益缩小的便携式设备上实现更多功能.阐述了大元件的底部填充.即一侧的尺寸超过15 mm,底部填充的胶量介于30~50mg.大尺寸晶元的制造工艺要求比现有生产线更大的产能,这就给底部填充点胶带来更大的挑战.大元件的产能超过3 000个/h时,需要点胶机点出非常多的胶水.如此多的胶水在出胶前通过点胶阀,这将会带来加热的问题一某些工艺要求出胶前胶水必须要加热.这会对胶点尺寸有影响,因为随着温度的变化,底部填充的胶水黏度也会随之变化,从而轻微影响点出的胶量.从而将影响晶元相邻的"非沾染区".稳定的温度是点胶稳定性的保证,并且能帮助胶水流进晶元下方同时也有助胶水分离从而更容易喷射出来.从研究中可以观察到:系统温度环境(点胶机内部)对点胶的胶水质量有影响.
微電子組裝的大部份工藝開髮都要求將元件做到更小,以便在呎吋日益縮小的便攜式設備上實現更多功能.闡述瞭大元件的底部填充.即一側的呎吋超過15 mm,底部填充的膠量介于30~50mg.大呎吋晶元的製造工藝要求比現有生產線更大的產能,這就給底部填充點膠帶來更大的挑戰.大元件的產能超過3 000箇/h時,需要點膠機點齣非常多的膠水.如此多的膠水在齣膠前通過點膠閥,這將會帶來加熱的問題一某些工藝要求齣膠前膠水必鬚要加熱.這會對膠點呎吋有影響,因為隨著溫度的變化,底部填充的膠水黏度也會隨之變化,從而輕微影響點齣的膠量.從而將影響晶元相鄰的"非霑染區".穩定的溫度是點膠穩定性的保證,併且能幫助膠水流進晶元下方同時也有助膠水分離從而更容易噴射齣來.從研究中可以觀察到:繫統溫度環境(點膠機內部)對點膠的膠水質量有影響.
미전자조장적대부빈공예개발도요구장원건주도경소,이편재척촌일익축소적편휴식설비상실현경다공능.천술료대원건적저부전충.즉일측적척촌초과15 mm,저부전충적효량개우30~50mg.대척촌정원적제조공예요구비현유생산선경대적산능,저취급저부전충점효대래경대적도전.대원건적산능초과3 000개/h시,수요점효궤점출비상다적효수.여차다적효수재출효전통과점효벌,저장회대래가열적문제일모사공예요구출효전효수필수요가열.저회대효점척촌유영향,인위수착온도적변화,저부전충적효수점도야회수지변화,종이경미영향점출적효량.종이장영향정원상린적"비첨염구".은정적온도시점효은정성적보증,병차능방조효수류진정원하방동시야유조효수분리종이경용역분사출래.종연구중가이관찰도:계통온도배경(점효궤내부)대점효적효수질량유영향.
In the world of microelectronic assembly most process developments are aimed at making smaller components to fit more functions into ever smaller portable devices. This study was designed to look at large device underfill, where the silicon die is over 15 mm on a side, and the amount of underfill required is on the order of 30 to 50 nag. The manufacturing process for these large die are pushing throughput requirements to much higher levels than seen on production lines today, bringing new chal-lenges to dispensingunderfill.When such large devices are produced at rates over 3 000 uph the have to move a lot of material. The sheer volume of material passing through a jet may present problems in heating fluids to the desired process temperatures before dispensing. This impacts the accuracy of shot size because underfill fluids change viscosity with changes in temperature, and for a given cycle, a jet's shot volume can changeslightly. This in turn impacts material keep-out zones next to the die. Constant temperature of the underfill fluids results in greater repeatability of shot size, aids flow under the die, and improves fluid break off. During this study, it was also observed that the system thermal environment (inside the dispensing machine) had an impact on the shot weight dispensed.