金属学报
金屬學報
금속학보
ACTA METALLURGICA SINICA
2009年
10期
1205-1210
,共6页
单晶Cu%分子动力学%位错%应力分布%切削厚度
單晶Cu%分子動力學%位錯%應力分佈%切削厚度
단정Cu%분자동역학%위착%응력분포%절삭후도
single crystal Cu%molecular dynamics%dislocation%stress distribution%cutting thickness
建立了单晶Cu纳米切削的三维分子动力学模型,研究了不同切削厚度下纳米切削过程中工件缺陷结构和应力分布的规律.纳米切削过程中,在刀具的前方和下方形成变形区并伴随缺陷的产生,缺陷以堆垛层错和部分位错为主.在纳米尺度下,工件存在很大的表面应力,随着切削的进行,工件变形区主要受压应力作用,巳加工表面主要受拉应力作用.随着位错在晶体中产生、繁殖及相互作用,工件先后经过弹性变形-塑性变形-加工硬化-完全屈服4个变形阶段,随后进入新的循环变形.结果表明:工件应力-位移曲线呈周期性变化;切削厚度较小时,工件内部没有明显的层错产生,随着切削厚度的增大,工件表面和亚表层缺陷增加;切削厚度越大,对应应力分量值越小.
建立瞭單晶Cu納米切削的三維分子動力學模型,研究瞭不同切削厚度下納米切削過程中工件缺陷結構和應力分佈的規律.納米切削過程中,在刀具的前方和下方形成變形區併伴隨缺陷的產生,缺陷以堆垛層錯和部分位錯為主.在納米呎度下,工件存在很大的錶麵應力,隨著切削的進行,工件變形區主要受壓應力作用,巳加工錶麵主要受拉應力作用.隨著位錯在晶體中產生、繁殖及相互作用,工件先後經過彈性變形-塑性變形-加工硬化-完全屈服4箇變形階段,隨後進入新的循環變形.結果錶明:工件應力-位移麯線呈週期性變化;切削厚度較小時,工件內部沒有明顯的層錯產生,隨著切削厚度的增大,工件錶麵和亞錶層缺陷增加;切削厚度越大,對應應力分量值越小.
건립료단정Cu납미절삭적삼유분자동역학모형,연구료불동절삭후도하납미절삭과정중공건결함결구화응력분포적규률.납미절삭과정중,재도구적전방화하방형성변형구병반수결함적산생,결함이퇴타층착화부분위착위주.재납미척도하,공건존재흔대적표면응력,수착절삭적진행,공건변형구주요수압응력작용,사가공표면주요수랍응력작용.수착위착재정체중산생、번식급상호작용,공건선후경과탄성변형-소성변형-가공경화-완전굴복4개변형계단,수후진입신적순배변형.결과표명:공건응력-위이곡선정주기성변화;절삭후도교소시,공건내부몰유명현적층착산생,수착절삭후도적증대,공건표면화아표층결함증가;절삭후도월대,대응응력분량치월소.
The increasing demand for designing and manufacturing micro parts with high qual-ity comes from the high speed development of micro electromechanical systems (MEMS) and nano electromechanical systems (NEMS) in recent years. Nanometric cutting as an important machining way of micro parts has become a hot spot in machining field. Some main issues in nanometric cutting such as chip formation, machined surface quantity and diamond tool wear etc., have been investigated by molecular dynamics. Previous researchers have pointed out that the generation and evolution of defects are mainly responsible for causing plastic deformation of machined workpiece in nanometric cutting of plastic materials and a high compressive stress remaining in shear zone is considered ben-eficial to ductile-mode machining of brittle materials. Up to now, however, the influence of cutting thickness on defect behaviors and stress distribution in a workpiece and the relationship between them for single crystal materials are still unclear. In the present study, molecular dynamics simulations of nanometric cutting of single crystal Cu were performed. The simulation results show that stacking fault and partial dislocation are two main types of the defects in workpieces. A high surface stress at the atomic scale was observed in workpieces and there exist the compressive stress in shear zones and tensile stresses in the machined surfaces. It is found that the stress-distance curves of workpieces present a clear periodicity corresponding to the generation and evolution of dislocations in them. At the beginning of cutting (a small cutting thickness), no apparent stacking faults inside workpieces have been found, but with the increase of cutting thickness, the defects on surfaces and subsurfaces increase significantly and the thicker the cutting thickness, the smaller the corresponding stress components.