光散射学报
光散射學報
광산사학보
CHINESE JOURNAL OF LIGHT SCATTERING
2003年
4期
268-275
,共8页
显微拉曼%硅半导体器件%薄膜厚度%应力
顯微拉曼%硅半導體器件%薄膜厚度%應力
현미랍만%규반도체기건%박막후도%응력
Micro-Raman%Si device%film thickness%strain
显微拉曼(μRS)在硅半导体器件生产中有许多重要和独特的应用.它可以提供一些非常重要的,于传统表征技术, 如四探针法,TEM, AFM, SEM 及XRD,相辅助的信息.本文报道μRS 在硅器件研究中的一些重要应用.我们成功的应用μRS研究技术上重要的TiSi2 C54相在TiS2 C40 模板上生长的过程,以及NiSi, NiSi2, CoSi, CoSi2 的形成过程.运用Si 衬底的拉曼信号,超薄硅化物薄膜的厚度(10nm)可以得到非常精确,便利的测量.薄膜的均匀性及晶粒的取向也可以在微米范围内进行评估. 利用UV激光在Si及GeSi 内极短的穿透深度,UV μRS 为下一代IC 材料SiGe及器件的研究,特别是应力研究,提供了独特的工具.毫无疑问,μRS 将在IC 工业中得到更加广泛的应用.
顯微拉曼(μRS)在硅半導體器件生產中有許多重要和獨特的應用.它可以提供一些非常重要的,于傳統錶徵技術, 如四探針法,TEM, AFM, SEM 及XRD,相輔助的信息.本文報道μRS 在硅器件研究中的一些重要應用.我們成功的應用μRS研究技術上重要的TiSi2 C54相在TiS2 C40 模闆上生長的過程,以及NiSi, NiSi2, CoSi, CoSi2 的形成過程.運用Si 襯底的拉曼信號,超薄硅化物薄膜的厚度(10nm)可以得到非常精確,便利的測量.薄膜的均勻性及晶粒的取嚮也可以在微米範圍內進行評估. 利用UV激光在Si及GeSi 內極短的穿透深度,UV μRS 為下一代IC 材料SiGe及器件的研究,特彆是應力研究,提供瞭獨特的工具.毫無疑問,μRS 將在IC 工業中得到更加廣汎的應用.
현미랍만(μRS)재규반도체기건생산중유허다중요화독특적응용.타가이제공일사비상중요적,우전통표정기술, 여사탐침법,TEM, AFM, SEM 급XRD,상보조적신식.본문보도μRS 재규기건연구중적일사중요응용.아문성공적응용μRS연구기술상중요적TiSi2 C54상재TiS2 C40 모판상생장적과정,이급NiSi, NiSi2, CoSi, CoSi2 적형성과정.운용Si 츤저적랍만신호,초박규화물박막적후도(10nm)가이득도비상정학,편리적측량.박막적균균성급정립적취향야가이재미미범위내진행평고. 이용UV격광재Si급GeSi 내겁단적천투심도,UV μRS 위하일대IC 재료SiGe급기건적연구,특별시응력연구,제공료독특적공구.호무의문,μRS 장재IC 공업중득도경가엄범적응용.
We demonstrate that micro-Raman spectroscopy (μRS) is a very useful technique that can be used to study a variety of problems related to Si device fabrication. It provides unique information complementary to those achievable using the conventional techniques, such as FPP (four point probe), TEM, AFM, SEM and XRD. In this talk, several important applications of μRS in the study of silicides and SiGe are described. The growth of the technologically important TiSi2 C54 phase on TiSi2 C40 template, as well as the formation of CoSi, CoSi2, NiSi and NiSi2 have been successfully monitored and interpreted. Thickness measurement of ultra-thin salicide films down to 10 nm has been accurately performed using attenuation of Si substrate Raman signal at 520 cm-1. Using the same Si peak and film uniformity can also be evaluated. The relative Raman intensity ratio variation shows that NiSi grains have different local orientation within micron regime, which provides information supplement those of GAXRD result. Utilizing the extreme short penetration of UV laser in Si and SiGe, UV μRS provides a unique technique in strain characterization of the next generation SiGe thin films (~5nm thick) and devices. Undoubtedly, μRS will feature more prominently in the IC industry.