半导体技术
半導體技術
반도체기술
SEMICONDUCTOR TECHNOLOGY
2010年
5期
443-446
,共4页
发光二极管%散热器%有限元%热分析%ANSYS软件
髮光二極管%散熱器%有限元%熱分析%ANSYS軟件
발광이겁관%산열기%유한원%열분석%ANSYS연건
LED%heat sink%finite element%thermal analysis%ANSYS software
以一款MR16 LED射灯为模型,采用ANSYS有限元软件进行热分析.以散热器翅片保持60℃为标准,通过实验与仿真相结合的方法,分析了LED射灯的热流功率、散热器基座厚度、LED芯片间距、对流面积对整个系统散热性能的影响.结果表明,散热器对流面积是影响灯具散热性能的最重要因素;对一定的散热器,存在一个有效的最大芯片输入功率.现有MR16 LED射灯的散热器最大散热功率只能达到2.5 W左右,要使散热功率增大并且发挥散热器最佳性能,必须增加散热器的对流面积.对该结构散热器散热性能的定量研究对今后高功率LED灯具的生产具有一定的指导意义.
以一款MR16 LED射燈為模型,採用ANSYS有限元軟件進行熱分析.以散熱器翅片保持60℃為標準,通過實驗與倣真相結閤的方法,分析瞭LED射燈的熱流功率、散熱器基座厚度、LED芯片間距、對流麵積對整箇繫統散熱性能的影響.結果錶明,散熱器對流麵積是影響燈具散熱性能的最重要因素;對一定的散熱器,存在一箇有效的最大芯片輸入功率.現有MR16 LED射燈的散熱器最大散熱功率隻能達到2.5 W左右,要使散熱功率增大併且髮揮散熱器最佳性能,必鬚增加散熱器的對流麵積.對該結構散熱器散熱性能的定量研究對今後高功率LED燈具的生產具有一定的指導意義.
이일관MR16 LED사등위모형,채용ANSYS유한원연건진행열분석.이산열기시편보지60℃위표준,통과실험여방진상결합적방법,분석료LED사등적열류공솔、산열기기좌후도、LED심편간거、대류면적대정개계통산열성능적영향.결과표명,산열기대류면적시영향등구산열성능적최중요인소;대일정적산열기,존재일개유효적최대심편수입공솔.현유MR16 LED사등적산열기최대산열공솔지능체도2.5 W좌우,요사산열공솔증대병차발휘산열기최가성능,필수증가산열기적대류면적.대해결구산열기산열성능적정량연구대금후고공솔LED등구적생산구유일정적지도의의.
With MR16 LED spot lamp as a model,thermal analysis is carried out by finite element of software ANSYS.Keeping heat sink fins 60℃ as standard,all components of the spot lamp which effected on thermal performance of entire system are analyzed concluding convection coefficient by experiment and simulation.The results show that convection area of heat sink is the most important factor influence on the thermal performance of lighting system.For a certain heat sink,there exists an effective highest input power of maximum chip.The existing heat sink of MR16 LED spot lamp can only achieve the maximum thermal power about 2.5 W,as for thermal power increasing,it needs to increase the convention area of heat sink.The quantitative study on the structure of heat sink will be certain significance for the future production of high-power LED lamps.