清华大学学报(英文版)
清華大學學報(英文版)
청화대학학보(영문판)
TSINGHUA SCIENCE AND TECHNOLOGY
2003年
2期
126-129
,共4页
赵宏锦%任天令%丛鹏%刘建设%刘理天%李志坚
趙宏錦%任天令%叢鵬%劉建設%劉理天%李誌堅
조굉금%임천령%총붕%류건설%류리천%리지견
bulk acoustic wave (BAW)%filter%resonator%surface micromachining%porous silicon
The most common typical bulk acoustic wave (BAW) filters are fabricated using bulk micromachining technology, but they have several disadvantages. This paper describes a new structure for front end passband BAW filters manufactured using surface micromachining. Porous silicon is used as a thick sacrificial layer. The structure reduces the influence of the support film on the filter to improve the VLSI compatibility as well as the filter quality. The cross-talk between resonators with different frequencies can be dramatically reduced by using resonators with a self-supporting structure.
