CAJ | 학술논문

研究用于电子器件高效冷却的小型平板热管(简称为热板)的传热机理，提出热板设计方案；采用粉末冶金的方法在热板蒸发端烧结毛细多孔层，强化了工质的沸腾换热过程；对热板进行了传热稳态和瞬态性能测试，分析工质充装量、毛细多孔层厚度、热板工作方式等因素对热板传热性能的影响。
연구용우전자기건고효냉각적소형평판열관(간칭위열판)적전열궤리，제출열판설계방안；채용분말야금적방법재열판증발단소결모세다공층，강화료공질적비등환열과정；대열판진행료전열은태화순태성능측시，분석공질충장량、모세다공층후도、열판공작방식등인소대열판전열성능적영향。
This paper develops a flat-plate heat pipe for cooling electroniccomponent of high power. A layer of sintered porous media is applied to the evaporation surface of the FPHP to enhance the heat transfer during the boiling of the working fluid. The transient and steady temperature distribution of the FPHP is measured, the effects of several factors,such as the working fluid filling rate, porous layer filling rate on the performance of the FPHP,are analyzed.