CAJ | 학술논문

采用气压浸渗法制备中体积分数电子封装用Al/Si/SiC复合材料.在保证加工性能的前提下,用与Si颗粒相同尺寸(13 μm)的SiC替代相同体积分数的硅颗粒制得复合材料,并研究其显微组织与性能.结果显示,颗粒分布均匀,未发现明显的孔洞.随着SiC的加入,强度和热导率将得到明显提高,但热膨胀系数变化较小,对使用影响也不大.讨论几种用于预测材料热学性能的模型.新的当量有效热导被引入后,H-J模型将适用于混杂和多颗粒尺寸分布的情况.
채용기압침삼법제비중체적분수전자봉장용Al/Si/SiC복합재료.재보증가공성능적전제하,용여Si과립상동척촌(13 μm)적SiC체대상동체적분수적규과립제득복합재료,병연구기현미조직여성능.결과현시,과립분포균균,미발현명현적공동.수착SiC적가입,강도화열도솔장득도명현제고,단열팽창계수변화교소,대사용영향야불대.토론궤충용우예측재료열학성능적모형.신적당량유효열도피인입후,H-J모형장괄용우혼잡화다과립척촌분포적정황.
The Al/Si/SiC composites with medium volume fraction for electronic packaging were fabricated by gas pressure infiltration.On the premise of keeping the machinability of the composites,the silicon carbide particles,which have the similar size with silicon particles (average 13 μm),were added to replace silicon particles of same volume fraction,and microstructure and properties of the composites were investigated.The results show that reinforcing particles are distributed uniformly and no apparent pores are observed in the composites.It is also observed that higher thermal conductivity (TC) and flexural strength will be obtained with the addition of SiC particles.Meanwhile,coefficient of thermal expansion (CTE) changes smaller than TC.Models for predicting thermal properties were also discussed.Equivalent effective conductivity (EEC) was proposed to make H-J model suitable for hybrid particles and multimodal particle size distribution.