CAJ | 학술논문

　　研究了在CuCl2-N H3-N H4 Cl和CuCl2-CuSO4-N H3-N H4 Cl体系中蚀刻废杂铜，考察了蚀刻液组成、铜氨溶液中初始离子质量浓度、温度、溶液流动状态、蚀刻液 pH 等因素对铜溶解速率的影响。结果表明：CuCl2-NH3-NH4Cl体系中，在铜质量浓度120～165 g/L、氯质量浓度150～200 g/L、pH 8．0～8．5、温度45℃、强化流动条件下，废杂铜的蚀刻速率为0．25 g/（min · L ）；CuCl2-CuSO4-N H3-N H4 Cl体系中，在铜质量浓度35～75 g/L、氯质量浓度35～80 g/L、p H 10．0～11．0、温度45℃、强化流动条件下，废杂铜的蚀刻速率为0．33 g/（min · L ）。
　　연구료재CuCl2-N H3-N H4 Cl화CuCl2-CuSO4-N H3-N H4 Cl체계중식각폐잡동，고찰료식각액조성、동안용액중초시리자질량농도、온도、용액류동상태、식각액 pH 등인소대동용해속솔적영향。결과표명：CuCl2-NH3-NH4Cl체계중，재동질량농도120～165 g/L、록질량농도150～200 g/L、pH 8．0～8．5、온도45℃、강화류동조건하，폐잡동적식각속솔위0．25 g/（min · L ）；CuCl2-CuSO4-N H3-N H4 Cl체계중，재동질량농도35～75 g/L、록질량농도35～80 g/L、p H 10．0～11．0、온도45℃、강화류동조건하，폐잡동적식각속솔위0．33 g/（min · L ）。
The etching of copper from waste copper scrap in CuCl2-NH3-NH4Cl and CuCl2-CuSO4-NH3-NH4Cl systems has been researched .The effects of etching solution composition ,initial ion concentration ,temperature ,flowing state and pH etching solution were investigated .The experimental results showed that the optimal conditions for etching copper in CuCl2-NH3-NH4Cl system were initial Cu2+ concentration of 120 ~ 165 g/L and Cl- concentration of 150 ~ 200 g/L ,pH of 8 .0 ~ 8 .5 , temperature of 45 ℃ ,the etching rate of copper was 0 .25 g/(min · L) .And in CuCl2-CuSO4-NH3-NH4Cl systems were initial Cu2+ concentration of 35~75 g/L and Cl- concentration of 35~80 g/L , pH 10 .0~11 .0 ,temperature 45 ℃ ,the etching rate reached 0 .33 g/(min · L) .