CAJ | 학술논문

在半导体生产商不断推进器件和圆片厚度薄型化的形势下,为满足与新产品和加工工艺有关的生产工艺挑战,必须采用更新的分裂方法.新面世的产品射频识别标签,更完善的IC卡以及集成度更高的存储器件,随着更新的从逻辑到存储器及图像传感器各种产品先进封装技术的来临,需要越来越薄基片.对此提出了一种基于临时键合以及新颖的粘接剂技术的适合于薄圆片传送和处理加工的完全解决方案(设备,材料以及工艺过程).这种方法与25 μm以下厚度圆片以及在原有设备没有变更的现有生产线进行薄圆片产品发展路线图加工工艺相适应.
재반도체생산상불단추진기건화원편후도박형화적형세하,위만족여신산품화가공공예유관적생산공예도전,필수채용경신적분렬방법.신면세적산품사빈식별표첨,경완선적IC잡이급집성도경고적존저기건,수착경신적종라집도존저기급도상전감기각충산품선진봉장기술적래림,수요월래월박기편.대차제출료일충기우림시건합이급신영적점접제기술적괄합우박원편전송화처리가공적완전해결방안(설비,재료이급공예과정).저충방법여25 μm이하후도원편이급재원유설비몰유변경적현유생산선진행박원편산품발전로선도가공공예상괄응.
As semiconductor manufacturer continue to push the thickness of devices and wafers down,new and disruptive methods to meet the manufacturing challenges associated with new products and processes have to be utilized. Emerging products, such as radio-frequency identification tags,more-sophisticated chip cards, or ever denser memory devices, along with the advent of new advanced packaging technologies for a variety of products ranging from logic to memory to image sensors require increasingly thinner substrates.In this paper a complete solution (equipment, material and process) for thin wafer handling and processing is presented based on temporary bonding and novel adhesives by Brewer Science. This approach is compatible with product roadmaps to less than 25 micron wafer thickness and enables processing of the thin wafers in existing fabs without modification of the existing equipment.