CAJ | 학술논문

讨论了集成电路向高集成度、高工作频率和高传输速率继续发展时，常规金属互连出现的困难以及集成电路芯片上光互连具有的潜在优势．介绍了组成芯片上光互连的光发射器件、光接收器件和光传输器件等三种基本器件及其与硅集成电路集成的研究新进展．最后展望了集成电路芯片上光互连的应用前景．
토론료집성전로향고집성도、고공작빈솔화고전수속솔계속발전시，상규금속호련출현적곤난이급집성전로심편상광호련구유적잠재우세．개소료조성심편상광호련적광발사기건、광접수기건화광전수기건등삼충기본기건급기여규집성전로집성적연구신진전．최후전망료집성전로심편상광호련적응용전경．
The limitations of conventional metallization interconnects of integrated circuits and the potential solution of the on-chip optical interconnect are discussed．The recent progress of the three basic optical interconnect devices （light emitter，photo receiver and optical waveguide） and their integration with silicon ICs are overviewed and reviewed．Finally，the prospect of on-chip optical interconnects on integrated circuits is appraised．